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Advanced Electronics Packaging Digest

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Incap Germany Expands Soldering with SEHO SelectLine-C 500

08/18/2026 | Incap
Incap Germany has further expanded its selective soldering capabilities with the commissioning of a new SEHO SelectLine-C 500.

Incap Launches Up to €15M Share Buyback Programme

08/11/2026 | Incap
The Board of Directors of Incap Corporation has decided to initiate a share buyback programme based on the authorisation given by the Annual General Meeting held on 20 May 2026.

Flex Posts Revenue Growth of 21% to $7.9 Billion in Q1 FY2027

08/03/2026 | Flex
This quarter reflects the continued execution of the strategy we've advanced over the last several years. From joining the S&P 500 to expanding our role in AI infrastructure, we've strengthened our position in attractive growth markets.

Incap Q2 Revenue Rises 34% to €74.2 Million

08/03/2026 | Incap
Incap Group reported strong second-quarter 2026 results, with revenue rising 34.1% year on year to €74.2 million and net profit more than tripling amid continued business growth.

Siemens Launches SIMATIC AX WinCC Unified Elements

07/31/2026 | Siemens
Siemens—a global leader in industrial AI and automation technology—announced the launch of SIMATIC AX WinCC Unified Elements, an IT-like engineering application for the SIMATIC WinCC Unified system.
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