-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
GEN3 Announces Exclusive UK Distribution Partnership with RAS for HATS2 Test System
November 19, 2024 | Gen3Estimated reading time: 2 minutes

GEN3, a leading British manufacturer of specialised test, measurement & production equipment for the electronics industry, is pleased to announce its partnership with Reliability Assessment Solutions Inc. (RAS), a leader in advanced reliability testing solutions. The company partnered with RAS as exclusive Global distributor for the HATS²™ (Highly Accelerated Thermal Shock) Test System. Developed by RAS, HATS²™ is designed for Convection Reflow Assembly Simulation and Thermal Shock/Cycling, offering precise reliability and robustness evaluation of PCB (Printed Circuit Board) and substrate via structures, including plated through-holes (PTHs).
The HATS²™ system is a cutting-edge solution that enables manufacturers to perform rigorous thermal shock testing on PCBs and Substrates, replicating real-world thermal cycling conditions to identify potential weaknesses and ensure the structural integrity of assemblies under high-stress environments. With its unique capabilities, HATS²™ is instrumental in enhancing quality control and durability testing, allowing manufacturers to meet and exceed industry standards.
GEN3, known for their expertise in distributing advanced electronic testing equipment, will now be the primary Global resource for companies interested in HATS²™. This partnership combines RAS’s innovative technology with GEN3’s strong network and commitment to quality, making HATS²™ accessible to manufacturers Worldwide.
“I’m thrilled to share that we’re partnering with Reliability Assessment Solutions Inc & Bob Neves, who we have worked with for many years, to add their innovative HATS²™ equipment to our portfolio of electronics reliability assurance equipment,” said GEN3 CEO Andrew Naisbitt. “This collaboration is a fantastic opportunity for us to enhance our offerings and better serve our customers’ needs. By integrating this technology, we’re not just expanding our portfolio, we’re empowering our clients with even more reliable tools to tackle their challenges. I’m excited about what this means for our future and can’t wait to see the positive impact it will have.”
“I have worked with the GEN3 team for many years and have used their Insulation Test Systems in my other businesses. I am excited to add the HATS²™ Via Structure/PTH Reliability and Robustness Test System to GEN3’s portfolio of products. The addition of the HATS²™ System to the GEN3 offerings adds Interconnection Reliability & Robustness Testing to their impressive array of Solderability, Cleanliness and Insulation System Test Equipment that they furnish the electronics industry, providing local sales, service & supplies to their customers,” said Bob Neves, Chairman RAS Inc.
For more information on the HATS2™ system or to learn how this partnership could support your business’s quality and reliability initiatives, please contact GEN3 directly.
Suggested Items
Insulectro Technology Village to Feature 35 Powerchats at IPC APEX EXPO 2025
03/11/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, will present its popular and successful 13.5-minute PowerChats™ during this year’s IPC APEX EXPO at the Anaheim Convention Center, March 18-20, 2025.
Recruiting the Next Generation of PCB Designers at Garmin
03/06/2025 | Andy Shaughnessy, I-Connect007Laura Beth (LB) Yates, PCB design engineering manager at Garmin, discusses the company's innovative approach to recruiting the next generation of PCB designers. As she points out, the best part of her job is “going to work every day with my friends and making cool stuff.”
Don’t Rush: Get ‘Acclimated’ With Each Level of SI
02/27/2025 | Andy Shaughnessy, I-Connect007During DesignCon, I met with Al Neves, the founder of Wild River Technology, and a serious fly fisherman as well. As Al explains, some engineers are getting ahead of themselves by rushing to take on complex SI challenges before they’ve mastered their foundational knowledge. Like climbers on Mount Everest, these engineers need to spend more time getting “acclimated” at base camp before heading for the summit.
It’s Only Common Sense: Success—The Devil's in the Details
02/24/2025 | Dan Beaulieu -- Column: It's Only Common SenseTo achieve business success, we often focus on the big picture—market share, revenue growth, and innovation. However, success is not simply about grand strategies or groundbreaking ideas. It’s the small, often overlooked touches that set the best businesses apart. As the saying goes, "The devil is in the details." I’d argue the angel is there, too. Here’s why details matter and how they can lead to success.
Marcy's Musings: It's Show Time!
02/20/2025 | Marcy LaRont -- Column: Marcy's MusingsIt’s hard to believe another year has gone by and it is time, once again, for IPC APEX EXPO. This year marks the 25th anniversary of this iconic show for the electronics industry and, in addition to all the usual suspects, there are some special things in store to celebrate this milestone. Last year, IPC themed the event, “What’s Next is Now.” This year’s theme, “Reimagine the Possibilities,” feels like a wholly appropriate follow-on.