Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
Global Citizenship: Comparing and Contrasting the U.S. and China PCB Industries
GEN3 Announces Exclusive UK Distribution Partnership with RAS for HATS2 Test System
November 19, 2024 | Gen3Estimated reading time: 2 minutes
GEN3, a leading British manufacturer of specialised test, measurement & production equipment for the electronics industry, is pleased to announce its partnership with Reliability Assessment Solutions Inc. (RAS), a leader in advanced reliability testing solutions. The company partnered with RAS as exclusive Global distributor for the HATS²™ (Highly Accelerated Thermal Shock) Test System. Developed by RAS, HATS²™ is designed for Convection Reflow Assembly Simulation and Thermal Shock/Cycling, offering precise reliability and robustness evaluation of PCB (Printed Circuit Board) and substrate via structures, including plated through-holes (PTHs).
The HATS²™ system is a cutting-edge solution that enables manufacturers to perform rigorous thermal shock testing on PCBs and Substrates, replicating real-world thermal cycling conditions to identify potential weaknesses and ensure the structural integrity of assemblies under high-stress environments. With its unique capabilities, HATS²™ is instrumental in enhancing quality control and durability testing, allowing manufacturers to meet and exceed industry standards.
GEN3, known for their expertise in distributing advanced electronic testing equipment, will now be the primary Global resource for companies interested in HATS²™. This partnership combines RAS’s innovative technology with GEN3’s strong network and commitment to quality, making HATS²™ accessible to manufacturers Worldwide.
“I’m thrilled to share that we’re partnering with Reliability Assessment Solutions Inc & Bob Neves, who we have worked with for many years, to add their innovative HATS²™ equipment to our portfolio of electronics reliability assurance equipment,” said GEN3 CEO Andrew Naisbitt. “This collaboration is a fantastic opportunity for us to enhance our offerings and better serve our customers’ needs. By integrating this technology, we’re not just expanding our portfolio, we’re empowering our clients with even more reliable tools to tackle their challenges. I’m excited about what this means for our future and can’t wait to see the positive impact it will have.”
“I have worked with the GEN3 team for many years and have used their Insulation Test Systems in my other businesses. I am excited to add the HATS²™ Via Structure/PTH Reliability and Robustness Test System to GEN3’s portfolio of products. The addition of the HATS²™ System to the GEN3 offerings adds Interconnection Reliability & Robustness Testing to their impressive array of Solderability, Cleanliness and Insulation System Test Equipment that they furnish the electronics industry, providing local sales, service & supplies to their customers,” said Bob Neves, Chairman RAS Inc.
For more information on the HATS2™ system or to learn how this partnership could support your business’s quality and reliability initiatives, please contact GEN3 directly.
Share on:
Suggested Items
SMTAI Returns to Its Chicago Roots
10/28/2024 | Nolan Johnson, SMT007 MagazineSMTA International, the anchor conference and exhibition for SMTA, returned to the Stephens Convention Center in Rosemont, Illinois, Oct. 20–24. After a COVID hiatus, followed by two years of co-locating with the MDMA show in Minneapolis, SMTAI went back to its Chicagoland home turf. The 2024 installment of the SMTAI event included more than 110 exhibitors, co-location with The ASSEMBLY Show, over 100 technical papers in the conference, technical forums, social activities, and renewed enthusiasm in the attendants.
June 2024 Design007 Magazine: Creating a Culture of Collaboration
06/10/2024 | I-Connect007 Editorial TeamPCB designers could learn quite a bit from NASA and the private companies that develop spacecraft: Every one of these vehicles is a testament to the value of collaboration among disparate stakeholders. Without a collaborative culture, the rocket might never get off the ground. In this issue of Design007 Magazine, our expert contributors to weigh in on collaboration, why communication with stakeholders is so critical, and how to set up a collaboration culture in your company.
Spring Into the Latest Issue of IPC Community
04/09/2024 | IPC Community Editorial TeamYou’ve put away the winter gear, the bulbs are in bloom, and the latest issue of IPC Community is ready for you. A few highlights from this issue include: Dr. John W. Mitchell’s update on what’s happening at IPC APEX EXPO 2024 this year; what’s on the horizon for IPC-7711/21; a longtime IPC member, Phil Kinner shares the tale of his 15,000-mile, six-year journey and so many more stories from the IPC community around the world.
Blackfox Ready for IPC APEX EXPO 2024
03/26/2024 | Andy Shaughnessy, I-Connect007Blackfox Training Institute offers IPC-certified training for a myriad of PCB assembly techniques and standard certifications. With many technologists beginning to eye retirement, this training is at a premium. I recently spoke with Jamie Noland, director of training and education for Blackfox, about the company’s latest educational efforts, and his plans for the upcoming IPC APEX EXPO, where Blackfox will be exhibiting.
Sales and Marketing: Our Roundtable of Experts
02/06/2024 | I-Connect007 Editorial TeamIf you’ve ever heard of a product and thought about how it would work in your life, that’s the result of marketing. It’s a subtle yet powerful force in how business operates today. For this issue of SMT007 Magazine, we gathered some of the most widely recognized authorities on marketing and selling electronics manufacturing services. They explain the sales and marketing process and what it takes to be successful in today’s competitive climate—whether you’re on the giving or receiving end.