Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

TSMC and MediaTek Collaboration Paves the Way for Next-gen Wireless Connectivity

03/13/2025 | TSMC
MediaTek and TSMC announced that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.

UHDI Fundamentals: UHDI Advances Neurotechnology

03/05/2025 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology is revolutionizing the field of neurotechnology and brain-computer interfaces (BCIs) by enabling unprecedented levels of miniaturization, complexity, and performance in neural devices. Here’s an in-depth look at how UHDI contributes to these domains.

Semiconductor Climate Consortium Announces Key 2025 Initiatives to Accelerate

03/04/2025 | SEMI
The Semiconductor Climate Consortium (SCC) unveiled its four key initiatives for 2025, marking a significant step forward in advancing the industry’s commitment to decarbonization and transparency.

IonQ Announces Innovations in Compact, Room-Temperature Quantum Computing through XHV Technology

02/21/2025 | BUSINESS WIRE
IonQ, a leader in the quantum computing and networking industries, announced the completion of its next-generation ion trap vacuum package prototype intended to realize smaller, more compact, room temperature quantum systems.

EdgeCortix SAKURA-I AI Accelerator Demonstrates Robust Radiation Resilience, Suitable for Many Orbital and Lunar Expeditions

01/29/2025 | EdgeCortix
EdgeCortix® Inc., a leading fabless semiconductor company specializing in energy-efficient Artificial Intelligence (AI) processing at the edge, announced that its SAKURA-I AI Accelerator is suitable for space missions including in Earth orbit and on the lunar surface, demonstrating high levels of radiation resiliency.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in