Standard of Excellence: The Human Touch in an Automated World
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
Global Sourcing Spotlight: How to Evaluate Supplier Capabilities Worldwide
Innovation Advisory Team Launches: Advancing WHMA’s Strategic Vision for Industry Growth
November 21, 2024 | IPCEstimated reading time: 1 minute
The Wiring Harness Manufacturers Association (WHMA) announces the launch of its Innovation Advisory Team (IAT), a strategic initiative aimed at driving technological advancements, enhancing industry practices, and elevating quality and efficiency within the wire harness sector.
As part of WHMA’s comprehensive strategic plan, the IAT will bring together experts from across the industry, including raw material manufacturers, equipment processing specialists, wire harness manufacturers, and academic thought leaders. With a mission to guide the adoption of cutting-edge technologies, the IAT will implement pilot programs that will shape the future of the wire harness industry.
“The launch of the Innovation Advisory Team marks a significant step forward in WHMA’s commitment to fostering industry growth,” said David Bergman, WHMA Executive Director.
The IAT will meet at least three times annually to evaluate emerging industry trends and recommend pilot programs designed to improve quality, boost efficiency, and reduce costs. Key insights and findings will be presented exclusively at WHMA’s Global Summit and Electrical Wire Processing Technology Expo (EWPTE), allowing members to gain early access to groundbreaking developments.
Key Benefits of Joining the IAT:
- Influence the adoption of new technologies and practices in the wire harness industry
- Collaborate with top industry professionals and expand your professional network
- Gain recognition as an industry leader
The IAT is now accepting applications. Visit our IAT website for more details and to submit your application today.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
North American EMS Industry Shipments Down 4.1% in July
08/27/2025 | Global Electronics AssociationThe Global Electronics Association announced today the July 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.23.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
TI Semiconductors Enable Advanced Earth-observation Capabilities of ISRO’s First-of-its-kind NISAR Mission
08/25/2025 | Texas InstrumentsTexas Instruments (TI) semiconductors are enabling the radar imaging and scientific exploration payloads for the NASA-Indian Space Research Organization (ISRO) synthetic aperture radar (NISAR) satellite, which was recently launched into orbit.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.
PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.