Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Global Notebook Shipments Expected to Grow by 4.9% in 2025, Business Demand Emerges as a Key Driver
November 25, 2024 | TrendForceEstimated reading time: 2 minutes
TrendForce reports that the global notebook market in 2024 is projected to recover at a moderate pace, hindered by high interest rates and geopolitical uncertainties. Annual shipments are forecast to reach 174 million units, marking a 3.9% YoY increase. Looking ahead to 2025, reduced political uncertainty following the U.S. presidential election and the Federal Reserve’s rate cuts in September 2024 are expected to stimulate capital flow. Combined with the end-of-service for Windows 10 and demand for commercial device upgrades, global notebook shipments are predicted to grow by 4.9% to 183 million units in 2025.
TrendForce notes that notebooks remain primarily productivity tools, with shipment growth driven largely by deferred replacement demand. The impact of AI-integrated notebooks on the overall market remains limited for now. However, AI features are expected to naturally integrate into notebook specifications as brands gradually incorporate them, resulting in a steady rise in the penetration rates of AI notebooks.
In terms of market segmentation, commercial notebooks faced headwinds in 2024 due to global layoffs and economic and political instability, leading to a more cautious demand environment. However, as these negative factors subside and rate cuts improve capital liquidity, the commercial market is expected to recover in 2025, with annual shipment growth surpassing 7%.
Conversely, the consumer market is driven by aggressive promotions in 2024, with entry-level models dominating sales, particularly in North America. For 2025, TrendForce predicts a more stable consumer market, with brands refocusing on high-value, high-margin models. While consumer notebook shipment growth may slow to 3%, the product mix will see significant optimization.
Chromebook demand in 2024 has been bolstered by educational procurement in North America and growing demand from emerging markets. In 2025, Japan’s GIGA School 2.0 initiative is expected to further drive Chromebook momentum, with shipment growth accelerating to 8% and sustaining a strong growth trajectory.
The global notebook market remains closely tied to U.S. trade policies, particularly the potential impact of heightened import tariffs under the “America First” policies introduced by the Trump administration. These measures could influence domestic demand in the U.S., pending the new administration’s implementation of such policies.
China remains the dominant manufacturing hub for global notebook production, accounting for approximately 89% of total capacity. While some ODMs are expanding production lines in Vietnam, Thailand, India, and Mexico, establishing a fully integrated supply chain ecosystem in these regions will require time. Additionally, there will likely be a transition period between the announcement and enforcement of related policies.
Consequently, TrendForce notes that the 2025 shipment forecast for notebooks may be subject to adjustments based on evolving market conditions.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).