-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Element Solutions to Participate in the UBS Global Technology and AI Conference
November 26, 2024 | Element Solutions Inc.Estimated reading time: Less than a minute
Element Solutions Inc announced that Benjamin Gliklich, Chief Executive Officer, will participate in a fireside chat at the UBS Global Technology and AI Conference in Scottsdale, AZ on Tuesday, December 3, 2024 at 7:35 a.m. MST.
A live audio webcast of the discussion and replay will be made available in the Investors section of Element Solutions’ website.
Suggested Items
Element Solutions Announces Q3 2024 Financial Results
10/29/2024 | BUSINESS WIRENet sales of $645 million, an increase of 8% on a reported basis or 6% on an organic basis from the third quarter of 2023
Designer's Notebook: Heterogeneous Integration and High-density SiP Technologies
10/03/2024 | Vern Solberg -- Column: Designer's NotebookOften, our primary goal is to maximize product functionality without increasing product size. Developing a multifunction silicon-based semiconductor (system-on-chip) for a specific product application, however, requires a significant investment in both engineering and financial resources. The problem is that many of the newer generations of semiconductor die have actually increased in size, with higher I/O and terminal pitch variations that have become significantly smaller.
The New Chapter: The Impact of Parasitics on PCB Design
08/28/2024 | Hannah Grace & Paige Fiet -- Column: The New ChapterThere are many considerations when planning and designing a board layout, and factors that include signal integrity, electromagnetic interference, and power integrity must be considered. Newer board designers often forget one factor crucial to a PCB’s performance and reliability, namely board parasitics, which usually refers to an unintended electrical effect in electronic components and interconnections. This can often lead to significant changes in the physical characteristics of the layout of the PCB. Typically, in board design, parasitics look similar to the length of a trace or a wire. Each trace is slightly resistive, slightly inductive, and slightly capacitive. These are commonly known as parasitic capacitance, parasitic inductance, and parasitic resistance.
Element Solutions Declares Q3 Dividend of $0.08 Per Share
08/21/2024 | BUSINESS WIREElement Solutions Inc announced that its board has declared a quarterly cash dividend of $0.08 per share of the company's common stock. The declared dividend will be paid on September 13, 2024 to stockholders of record as of the close of business on August 30, 2024.
All Flex Solutions Achieves AS9100 Recertification
07/10/2024 | All Flex SolutionsThe Flex Circuit Center of Excellence of All Flex Solutions was recently recertified to the AS9100 accreditation, which is awarded based on upholding a high standard in quality management system requirements. The AS9100 certification was created to ensure that an accredited manufacturer can meet the unique standards required by the aerospace, aviation, and defense industries.