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AI Chips for the Data Center and Cloud Market Will Exceed US$400 Billion by 2030

05/09/2025 | IDTechEx
By 2030, the new report "AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts" from market intelligence firm IDTechEx forecasts that the deployment of AI data centers, commercialization of AI, and the increasing performance requirements from large AI models will perpetuate the already soaring market size of AI chips to over US$400 billion.

L3Harris, Thales Develop Next-Generation SHORAD Capability

05/05/2025 | L3Harris Technologies
L3Harris Technologies has signed a memorandum of understanding with Thales UK to develop an integrated short-range air defence (SHORAD) command and control capability.

AdvancedPCB Appoints Gary Stoffer as Chief Commercial Officer

04/18/2025 | PRNewswire
AdvancedPCB is proud to announce the appointment of Gary  Stoffer as its new Chief Commercial Officer (CCO). In this role, Stoffer will lead all sales,  marketing, and commercial strategy initiatives as the company continues its mission to deliver cutting-edge PCB solutions to industries worldwide.

Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe

04/15/2025 | Indium Corporation
Indium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.

STMicroelectronics, Innoscience Sign GaN Technology Development and Manufacturing Agreement

04/02/2025 | STMicroelectronics
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and Innoscience, the world leader in 8” GaN-on-Si (gallium nitride on silicon) high-performance low-cost manufacturing, announce the signature of an agreement on GaN technology development and manufacturing, leveraging the strengths of each company to enhance GaN power solutions and supply chain resilience.
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