CIMS, a leader in inspection solutions for the electronics manufacturing industry, will participate in the Hong Kong Printed Circuit Association (HKPCA) Show 2024. The event will take place in Shenzhen, China, from December 4th to 6th, offering a platform for CIMS to highlight its cutting-edge technologies.
Attendees are invited to visit CIMS at booth 5D01, where the company will present its latest innovations. These include Spark™ 4.0, a powerful software inspection engine designed to enhance accuracy and efficiency. CIMS will also showcase advanced inspection solutions tailored for IC substrates, Ucamco's next-generation pre-CAM and full CAM software, and advanced material handling automation solutions that cater to all PCB industry segments.
CIMS is dedicated to driving progress in the electronics manufacturing sector, and this event marks an opportunity to demonstrate its commitment to innovation and excellence.