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EMS Providers Should ‘Plan Prudently’ in 2025

01/08/2025 | Nolan Johnson, SMT007 Magazine
Dennis Reed is a senior research analyst who specializes in electronics manufacturing at Edgewater Research, a leading research and market intelligence firm covering a mix of compute—CPU, GPU, memory, both flash and DRAM, and hard drive—and insights on components which includes broad line semiconductor, IP&E distribution, and channels.

MicroCare Welcomes Greg Gascon as Strategic Account Executive

01/06/2025 | MicroCare, LLC
MicroCare, LLC, a global leader in critical cleaning solutions, is excited to announce that Greg Gascon has joined the team as a Strategic Account Executive.

Solar Powered Aircraft Achieves New Stratospheric Success

12/26/2024 | BAE Systems
A British-led team of engineers has taken a leap forward in the race to harness the stratosphere for earth observation and communications, completing a new series of test flights of BAE Systems’ High Altitude Pseudo Satellite (HAPS) Uncrewed Aerial System (UAS), PHASA-35®, in quick succession. 

The Effects of Copper on a Transmission Line

12/23/2024 | Todd Kolmodin, Gardien Services
As technology advances, our substrates become increasingly smaller, and chip technology has progressed to where HDI and UHDI are household terms. Ten years ago, this new design architecture would strike fear in the hearts of any plating engineer. Unfortunately, North American and European manufacturing has lagged due to excessive offshoring of commercial and some high-reliability product lines. Fortunately, most of the military and aerospace product has remained controlled. But in doing so, the designs utilized by the mil/aero and medical sectors’ reliability lines were corralled into the manufacturing capabilities of the North American and European providers.

OKI Develops PCB Technology with Stepped Copper Coin Insertion to Achieve 55 Times Better Heat Dissipation in Outer Space

12/12/2024 | BUSINESS WIRE
The OKI Group printed circuit board (PCB) business company OKI Circuit Technology has successfully developed multilayer PCB technology with stepped copper coin insertion to achieve 55 times better heat dissipation compared to conventional PCB. The stepped copper coin is offered in two types, circular and rectangular, to suit the shape of the electronic component mounted on the PCB. OTC is working to develop mass-production technologies with the aim of introducing PCBs incorporating this new technology into markets for compact devices or devices used in outer space or other environments where air cooling technology cannot be used.
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