The Shaughnessy Report: Showing Some Constraint
Elementary, Mr. Watson: Rein in Your Design Constraints
Target Condition: Are Autorouters Friend or Foe?
Foxconn Showcases Satellite Technology and Industry Ecosystem at TASTI 2024
December 3, 2024 | FoxconnEstimated reading time: 1 minute
Hon Hai Technology Group (Foxconn) participated in the 2024 Taiwan Space International Annual Conference (TASTI 2024) being held November 30 - December 4, 2024, showcasing its latest advancements in low-orbit satellite communications and its commitment to building a robust satellite industry ecosystem.
At the exhibition, Hon Hai displayed a 1:1 physical model of the Pearl CubeSat, a satellite successfully launched in November 2023. The company demonstrated key technologies such as satellite tracking, three-axis stabilization, Earth observation, and two-way communication.
Hon Hai also collaborated with its subsidiaries and industry partners to showcase the entire satellite communications value chain, including satellite user terminals developed by FIH and Sharp, camera modules by Rayprus, and space-grade connectors and cables from Hongteng Precision. Additionally, MediaTek showcased its fully software-defined radio (SDR) chip for non-terrestrial networks, and Antaris presented its innovative multi-orbit satellite operation software platform.
Wu Renming, Director of Hon Hai Research Institute’s New Generation Communications Research Institute, highlighted the future of satellite communications, emphasizing the importance of high coverage, high reliability, high connectivity, and low latency. He noted that non-terrestrial networks are poised to play a crucial role in the evolution of 5G and 6G technologies.
Zhao Yuanhan, Director of the B5G policy group at Hon Hai Technology Group, emphasized the cost-effectiveness and convenience of launching low-orbit satellites. Hon Hai aims to leverage its strengths and partner resources to provide comprehensive solutions in key areas such as components, subsystems, assembly, integration, and testing, accelerating the development of the new space industry.
Share on:
Suggested Items
KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics
07/15/2025 | KONIGKONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating system that brings new levels of precision, speed, and material efficiency to electronics manufacturing.
Electronics Manufacturing & Assembly Collaborative (EMAC) Announces Innovative Student Competition
07/15/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced the launch of the Bright Manufacturing Challenge 2025, a revolutionary hands-on competition that transforms how students experience electronics manufacturing and robotics engineering.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.