- 
                                  
- News
-  Books
                        Featured Books
- design007 Magazine
Latest IssuesCurrent Issue  Power IntegrityCurrent power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.   Signal IntegrityIf you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.   Proper Floor PlanningFloor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right. 
- Articles
- Columns
- Links
- Media kit||| MENU
- design007 Magazine
Foxconn Showcases Satellite Technology and Industry Ecosystem at TASTI 2024
December 3, 2024 | FoxconnEstimated reading time: 1 minute
Hon Hai Technology Group (Foxconn) participated in the 2024 Taiwan Space International Annual Conference (TASTI 2024) being held November 30 - December 4, 2024, showcasing its latest advancements in low-orbit satellite communications and its commitment to building a robust satellite industry ecosystem.
At the exhibition, Hon Hai displayed a 1:1 physical model of the Pearl CubeSat, a satellite successfully launched in November 2023. The company demonstrated key technologies such as satellite tracking, three-axis stabilization, Earth observation, and two-way communication.
Hon Hai also collaborated with its subsidiaries and industry partners to showcase the entire satellite communications value chain, including satellite user terminals developed by FIH and Sharp, camera modules by Rayprus, and space-grade connectors and cables from Hongteng Precision. Additionally, MediaTek showcased its fully software-defined radio (SDR) chip for non-terrestrial networks, and Antaris presented its innovative multi-orbit satellite operation software platform.
Wu Renming, Director of Hon Hai Research Institute’s New Generation Communications Research Institute, highlighted the future of satellite communications, emphasizing the importance of high coverage, high reliability, high connectivity, and low latency. He noted that non-terrestrial networks are poised to play a crucial role in the evolution of 5G and 6G technologies.
Zhao Yuanhan, Director of the B5G policy group at Hon Hai Technology Group, emphasized the cost-effectiveness and convenience of launching low-orbit satellites. Hon Hai aims to leverage its strengths and partner resources to provide comprehensive solutions in key areas such as components, subsystems, assembly, integration, and testing, accelerating the development of the new space industry.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Aircraft Wire and Cable Market to surpass USD 3.2 Billion by 2034
10/30/2025 | Global Market Insights Inc.The global aircraft wire and cable market was valued at USD 1.8 billion in 2024 and is estimated to grow at a CAGR of 5.9% to reach USD 3.2 billion by 2034, according to recent report by Global Market Insights Inc.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Fresh PCB Concepts: Resilience and Renewal in Domestic PCB Manufacturing
                                         Fresh PCB Concepts: Resilience and Renewal in Domestic PCB Manufacturing Designers Notebook: Power and Ground Distribution Basics
                                         Designers Notebook: Power and Ground Distribution Basics Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics
                                         Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics





 
                     
                 
                    