-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueThe Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
2024 IPC K-FEST: Shaping the Future of the Electronics Industry
December 6, 2024 | IPCEstimated reading time: 2 minutes
IPC K-FEST 2024, the 2nd annual IPC Korea Festival of Electronics Standards and Technology, was held in Seoul on October 29. The focus of this year’s event centered on the integration of Korea's technological leadership with international standards development.
The conference attracted160 industry professionals from approximately 80 companies. This one-day event featured technical seminars, an IPC-A-610 regional task group meeting, and the IPC Korea Annual Awards as key highlights. IPC Asia President Sydney Xiao and IPC Board member, Jae-sang Min, LG Electronics, gave welcome speeches to open the event.
Technical seminars focused on addressing challenges in the electronics manufacturing industry, demonstrating how IPC standards enhance manufacturing performance and quality. Participants engaged in active discussions across seven topics: Digitalization of Electronics Manufacturing – Towards Smart Factory enabling Industry 4.0; Mastering Challenges in Electronics for Electric Vehicles; Evaluation and Prediction of MLCC Ionic Migration in Electronics; Material Selection and Technical Solution of Conformal Coating; Improving Performance and Reliability at PCB Design Phase, Requirements and Acceptance Specifications for Organic Packaging Substrates, and the Relationship of Sn Plating and IMC at PCBA.
During the awards luncheon, IPC Korea staff awarded various individual volunteers. Rounding out the day, the IPC-A-610 regional task group meeting was held, which aimed to involve more Korean engineers into IPC’s global standardizations activities.
Jae-sang Min, IPC Board member, highly praised the achievements made by the IPC Korea team since 2021. “Although currently there are not many Korean people participating in IPC standardization compared with Korea's leading position in the electronics industry and the importance of IPC in the electronics industry, I believe that in the near future, the IPC Korea team, through platforms such as IPC K-FEST, will surely lead more and more Korean electronics manufacturing companies and experts to the world standardization stage,” he stated.
The Korean Government project, “De-facto Standard Forum” sponsored this event and Jong-won Kwon, general project director of the De-facto Standard Forum said, “IPC K-FEST is exactly the kind of event that we are expecting to see. We, the Korean De-facto Standard Forum, would like to support IPC as much as we can.” MacDermid Alpha Electronics Solutions and K&P Co., Ltd. sponsored supplies for this event.
“My special thanks go to the IPC Korea team and IPC Korea Advisory Committee for their dedication in making this event possible. We are confident that it will continue to attract greater interest from Korea’s industry, potentially evolving into a global event, and thus promoting more industry experts to participate in the development of IPC standards,” said Sydney Xiao, IPC Asia president.
Suggested Items
The Test Connection, Inc. to Showcase Advanced Testing Solutions at SMTA Austin Expo & Tech Forum
02/04/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is excited to announce its participation in the SMTA Austin Expo & Tech Forum on February 6, 2025 in Austin, Texas.
Nolan's Notes: Find the Help You Need—Accessing Technical Resources
02/04/2025 | Nolan Johnson -- Column: Nolan's NotesSome close friends of mine have a card catalog in their family room—with the cards still in it. It’s just a novelty now, but it wasn’t that long ago that the card catalog was the end-all, be-all of research resources. As a college student, I remember something like two dozen or more of the very large card catalog cabinets in the Oregon State University Library. It’s not lost on me that my friend’s card catalog “liberated” from the university is a snapshot of that particular knowledge base at that particular moment in time. Today’s access to a library’s contents have changed dramatically.
Happy’s Tech Talk #37: New Ultra HDI Materials
02/03/2025 | Happy Holden -- Column: Happy’s Tech TalkSome new materials have been introduced in the past year for ultra high density interconnect (UHDI), a convenient title for developing high density technologies. They have received labels like semiconductor-like PCBs (SLPs), redistribution layers (RDL), flip-chip ball grid array (FCBGA), and interposers. The early 2000s saw the creation of these organic substrates for flip-chip IC packaging. The initial construction was composed of a BT core with build-up layers of the Ajinomoto Build-up Film (ABF)
Mind Meld: Brian Chislea and AJ Arriaga Share Their Fascinating Experience in IPC's Mentorship Program
01/28/2025 | Michelle Te, IPC CommunityIPC’s Emerging Engineer program provides professionals an opportunity early in their careers to learn from dedicated industry volunteers participating in standards development. Two participants in the program—Brian Chislea, Dow Chemical, mentor to AJ Arriaga, Summit Interconnect—share their experiences in the program in a series of articles. We will follow them through their three years in the mentorship. This is the first in the series.
The Test Connection, Inc. Launches The Training Connection to Address Critical Test Engineering and Development Needs
01/24/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is excited to announce the launch of its newest venture, The Training Connection, LLC, a company dedicated to addressing the growing need for practical and effective training in test engineering and development. With a focus on critical methodologies such as Design for Test (DFT) and IPC standards, The Training Connection is poised to empower professionals with the tools and expertise they need to excel.