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Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
December 9, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Advanced Packaging and Stackup Design
As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing that this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
For the December 2024 issue of Design007 Magazine, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.
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