Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

KYZEN to Feature MICRONOX MX2123 Power Module Cleaner at iMAPS Wire Bonding Workshop

01/22/2025 | KYZEN'
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (iMAPS) Wire Bonding 2025 Workshop and Tabletop Exhibition, scheduled to take place February 3-4 at the Westin San Diego Bayview.

StratEdge Partners with Vitale Engineering as Manufacturer's Representative for Upstate New York

01/22/2025 | StratEdge
StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, has appointed Vitale Engineering as its exclusive Manufacturer’s Representative for Upstate New York. Known for their customer-focused approach and technical expertise,

Department of Commerce Finalizes Long-Term Partnership with Natcast to Operate the National Semiconductor Technology Center

01/20/2025 | U.S. Department of Commerce
The U.S. Department of Commerce announced the National Institute of Standards and Technology (NIST) has awarded Natcast up to $6.3 billion to operate the National Semiconductor Technology Center (NSTC) under a long-term agreement with NIST.

U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging

01/17/2025 | U.S. Department of Commerce
The U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing.

NAMICS Brings Innovative Thermoset Materials to PCB Fabrication

01/16/2025 | Andy Shaughnessy, Design007 Magazine
At PCB Carolina, Matt Lake and Ken Araujo of NAMICS Technologies spoke with Andy Shaughnessy about the introduction of an innovative thermoset material to PCB fabrication. This groundbreaking material, originally developed for the semiconductor packaging industry, addresses a longstanding demand for unreinforced thermoset films that enhance dielectric properties in PCB applications and allow for manufacturing the very finest of features, 0.002" and below.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in