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How Printed Circuit Boards Power Our Everyday Gadgets
December 12, 2024 | PRNewswireEstimated reading time: 2 minutes
According to the latest study from BCC Research, the demand for Printed Circuit Boards: Technologies and Global Markets was valued at $67.9 billion in 2023 and is projected to grow from $70.9 billion in 2024 to $92.4 billion by the end of 2029, at a compound annual growth rate (CAGR) of 5.4% from 2024 through 2029.
This report looks at current trends in the global printed circuit board (PCB) market, using data from 2023 and forecasts from 2024 to 2029. It breaks down revenue by market segments such as assembly technology and PCB type, and by region, including North America, Europe and Asia-Pacific.
It explores what's driving and challenging the market's growth, identifies leading PCB manufacturers, and reviews new technologies and competitive factors in the industry. Additionally, the report assesses the impact of environmental, social, and governance (ESG) issues on the PCB sector.
Some Interesting facts:
- Even after the pandemic ended, its effects were still being felt in 2023. The global PCB market suffered a significant decline due to factors like destocking and rising interest rates to curb inflation. The automotive and consumer electronics industries faced severe shortages of PCBs, which were in high demand because of 5G and the Internet of Things (IoT). This shortage led to higher prices, longer lead times, and stock-outs, affecting PCB manufacturers' production.
- China, the U.S., Taiwan, and South Korea are major PCB producers. In 2023, China produced 53.3% of the world's PCBs thanks to its large production capacity, cost-effective manufacturing, and strong supply chain.
- The trade conflict between the U.S. and China has significantly impacted the PCB market. U.S. imports from China dropped by 20.4% in 2023. As a result, the U.S. is shifting some PCB production to other regions, including Southeast Asia, with countries such as Vietnam and Taiwan becoming popular choices to avoid tariffs and diversify supply chains.
- Multilayer and high-density interconnection (HDI) are the most popular types of PCBs. They offer more design flexibility and higher circuit density, making them suitable for complex and compact electronics. They also provide better signal integrity, which is essential for high-speed communication in computer motherboards, smartphones, medical devices and aerospace electronics.
Factors contributing to this market's growth include:
- Growing use of autonomous and electric vehicles (AVs/EVs): More vehicles are being designed to drive themselves and run on electricity instead of gasoline. This shift is driven by the desire for safer, eco-friendly transportation and is transforming the automotive industry by introducing new technologies and reducing reliance on fossil fuels.
- Demand for consumer electronics and IoT devices: Consumer electronics and IoT devices are becoming increasingly central to modern lifestyles, homes and workplaces. More and more people want gadgets like smartphones, smartwatches and smart home products. These devices make life easier and more connected by allowing us to control and monitor various aspects of our lives through the internet.
- Rising adoption of 5G technology: More people and businesses are starting to use the latest mobile network, which is faster and more reliable than previous ones (4G and LTE). This improved connectivity supports faster internet speeds, better streaming, and the ability to connect many devices at once.
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Brent Fischthal - Koh YoungSuggested Items
Neways Begins Delivery of Saab’s UTAAS Integrated Sight and Fire Control Systems
02/11/2026 | NewaysNeways, the global innovator in mission-critical technology for semicon, defense & mobility, and connectivity sectors, has started production and delivery of critical sub-systems for Saab’s UTAAS (Universal Tank and Anti-Aircraft System) integrated sight and fire control systems for BAE Systems’ CV90 infantry fighting vehicles.
EIPC Winter Conference 2026 Review: The Keynote Sessions
02/11/2026 | Pete Starkey, I-Connect007Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.
Google’s High-Speed Interconnect Architecture to Push 800G+ Optical Transceiver Share Past 60% by 2026
02/10/2026 | TrendForceGoogle’s next-generation TPU, Ironwood, integrates a 3D Torus network topology with the Apollo optical circuit switch (OCS) all-optical network, marking a major step forward in AI data-center interconnect design.
Qnity Introduces First Ceria PCMP Clean for Advanced, Sustainable Semiconductor Manufacturing
02/09/2026 | QnityQnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced its first post-chemical mechanical planarization (PCMP) cleaning solution designed specifically for ceria applications.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
02/06/2026 | Nolan Johnson, I-Connect007Here’s the thing about time travel. You can’t just manipulate the time dimension; you have to move in three-dimensional space as well. That’s because Earth orbits a star, which orbits a galaxy, which is on its own path through three-dimensional space. Our planet follows a complex corkscrew-like path through the universe, covering great distances in just seconds. Build a time machine like HG Wells envisioned, and even a short jump in time means that Earth has moved, and you’re now floating in the void of space. Unsettling, to be sure.