It’s Only Common Sense: You’ve Got to Hustle
Dan’s Biz Bookshelf: ‘Brand Hijack: Marketing Without Marketing’
IPC Releases Latest List of Standards and Revisions
December 17, 2024 | IPC Community Editorial TeamEstimated reading time: 1 minute
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.
IPC-2294
Design Standard for Printed Electronics on Rigid Substrates
IPC-2294 establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on rigid substrates. Rigid substrates, as applies to the IPC-2294 standard, are those that are not required to be flexed into a new shape for the purposes of assembly or operation. The rigid substrate can be conductive (e.g., rigid printed board or assembly), semiconductive, or nonconductive.
IPC-6904
Qualification and Performance Specification for Printed Electronics on Rigid Substrates
IPC-6904 establishes and defines the qualification and performance requirements for printed electronics and their forms of component mounting and interconnecting structures on rigid substrates. The substrate can be conductive, semiconductive, or nonconductive.
IPC/Hermes-9852-v1.6
The Global Standards for Machine-to-Machine Communication in SMT Assembly
IPC-Hermes-9852 provides a state-of-the-art communication protocol for machine-to-machine communication for surface mount technology. Used with IPC-2591, Connected Factory Exchange, IPC-Hermes-9852 can assist any electronics manufacturer, large or small, to align their companies with Smart manufacturing and Industry 4.0. Version 1.6 includes updates to SendBoardInfo and capabilities for Hermes-enabled equipment to be queried on its Hermes capabilities.
To see the rest of the standards released for Q4, which were featured in the Fall 2024 issue of IPC Community, click here.
Share on:
Suggested Items
GB200 Rack Supply Chain Requires Further Optimization, Peak Shipments Expected Between 2Q25 and 3Q25
12/18/2024 | TrendForceAs the market closely follows the progress of NVIDIA’s GB200 rack-mounted solution, TrendForce’s latest research indicates that the supply chain requires additional time for optimization and adjustment.
Wearables to Face Continued Growth While Giving Way to New Form Factors
12/18/2024 | IDCGlobal shipments for wearables are on track to grow 6.1% by the end of the year, reaching 538 million units according to new data from the International Data Corporation (IDC) Worldwide Quarterly Wearable Device Tracker.
Curtiss-Wright Announces New $100 Million Expansion of 2024 Share Repurchase Program, Raises Minimum Annual Repurchase Plan to $60 Million for 2025
12/17/2024 | Curtiss-Wright CorporationCurtiss-Wright Corporation announced a $100 million expansion of its 2024 share repurchase program, which it expects to complete via a 10b5-1 program by the end of the year.
RTX's Collins Aerospace Announces Avionics Modernization Program for King Air and Hawker Aircraft
12/17/2024 | RTXCollins Aerospace, an RTX business, has announced a comprehensive avionics upgrade and modernization program for Beechcraft King Air and Hawker aircraft, spanning Collins' Pro Line Fusion® and Pro Line 21™ advanced avionics systems.
Seventh Lockheed Martin-Built GPS III Satellite Launches
12/17/2024 | Lockheed MartinThe seventh Lockheed Martin-designed and -built Global Positioning System (GPS) III space vehicle, GPS III SV07, launched from Cape Canaveral Space Force Station, Florida, into orbit 12,550 miles above earth.