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Bell Announces Site Selection for Future Long Range Assault Aircraft Fuselage Assembly

11/06/2024 | Bell Textron Inc.
Bell Textron Inc., a Textron Inc.  company, announced the site selection for the Future Long Range Assault Aircraft (FLRAA) fuselage assembly in Wichita, Kansas at an existing facility located at Beech Field on Textron Aviation’s East Campus near the site of Textron Aviation Defense. Bell plans to begin operations at the facility in the next several months.

Bell Awarded Funding for Phase 1B of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program

05/30/2024 | Bell
Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 1B of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program.

The Next Chapter for Bell’s H-1 Helicopters Begins

04/01/2024 | Bell Textron Inc.
The first Bell AH-1Z set to receive the Structural Improvement Electrical Power Upgrade (SIEPU) modification to be provided by Bell Textron Inc., a Textron Inc company, under a contract with the U.S. Marine Corps, has arrived at Bell’s Amarillo Assembly Center. 

Bell Announces Bell 505 Dealership Agreement with Chinook Helicopters

02/29/2024 | Bell Textron Inc.
Bell Textron, a Textron Inc. company, announced during the HAI Heli-Expo 2024 held in Anaheim, California, that it has appointed Chinook Helicopters as an authorized Bell 505 dealership serving western Canada. “With our 42-year history of flying Bell helicopters, we are enthusiastic about our relationship with a world-leading aircraft manufacturer and genuinely thrilled to be working alongside them,” said Cathy Press, CEO, Chinook Helicopters.

iNEMI LTS Tech Topic Series: Thermal Fatigue Performance in BiSn-Based Low-Temperature Solder Joints

01/31/2024 | iNEMI
There is an increasing interest in some market segments to use solder alloys with lower melting temperatures for electronics assembly. Low-temperature solder (LTS) can provide manufacturing, economic, and environmental benefits. Since 2015, the iNEMI BiSn-Based Low-Temperature Soldering Process and Reliability project has been evaluating LTS paste formulations based on the Bi-Sn system.
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