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Spotlight on PEDC: Filbert Arzola
December 19, 2024 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute

IPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna.
Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.
Q: Why is your PEDC class important?
A: My PEDC presentation is very important. It takes a deep dive into model-based PCB design engineering and adapting to modernized sustainability and Digital Twins methodologies. We will review and discuss each topic and how they intersect and drive each other.
Q: What can attendees expect from your class?
A: Attendees of my presentation will learn from my 30+ years of PCB design engineering and how the "New Age" of engineering methodologies will improve global PCB design engineering.
Q: What do you hope each attendee takes away from your class?
A: My hope is that each person attending my presentation will better understand that PCB design is not just drafting and autorouting—it is, in fact, engineering. I also hope that everyone will see the importance and responsibility we all share as we innovate and improve our design engineering processes to include the baselines of sustainability and Digital Twins.
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RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.
The Right Blend: Mixed Wireless Technologies
05/08/2025 | Kirsten Zima, Siemens EDAA common trend recently is to employ as many radios as possible on a single PCB. With the increase of wireless standards and the downscaling of PCB size, it can be difficult to know what the most critical design parameters are to focus on. In this article, we’ll discuss the most important considerations to make when designing with mixed wireless technologies, such as Bluetooth, GPS, and Wi-Fi, on a single PCB. These considerations include antennas, frequencies, FCC compliance, shielding, and layout with and without transition vias.
ZESTRON Announces New Reliability and Solutions Service for Risk Assessment & Mitigation of Electronic Assemblies
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PCB East Continues to Expand
05/06/2025 | Andy Shaughnessy, Design007 MagazineIt was a perfect week for a conference and trade show in metropolitan Boston, with high temperatures in the 70s. PCB East took place at the Boxboro Regency Hotel and Conference Center April 29–May 2, with the expo on April 30. PCB East has been expanding since its relaunch a few years ago, with conference and show attendance rising each year.