Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

VIA Announces Strategic Collaboration with Solectrix

03/13/2025 | VIA optronics AG
VIA optronics AG, a leading supplier of interactive display solutions, today announced a new strategic collaboration with Solectrix GmbH, a full-service provider in the embedded electronics sector.

Würth Elektronik Now an Infineon ‘Preferred Partner’

03/13/2025 | Wurth Elektronik eiSos
Würth Elektronik, one of the leading manufacturers of electronic and electromechanical components, is broadening its collaboration with semiconductor manufacturers.

YINCAE: UF 158UL Redefines Underfill for Large Chips

03/12/2025 | YINCAE
YINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.

ICT Spring Seminar: Nickel Not Welcome Here

03/12/2025 | Pete Starkey, I-Connect007
After a miserable, dull, and damp English winter, a really pleasant nearly spring day with the sun shining and daffodils in bloom greeted delegates to the Institute of Circuit Technology Spring Seminar at Puckrup Hall near Tewkesbury, March 5, in Gloucestershire, UK.

indie Semiconductor and GlobalFoundries Announce Strategic Collaboration to Accelerate Automotive Radar Adoption

03/12/2025 | GlobalFoundries
indie Semiconductor, an automotive solutions innovator, has announced a strategic collaboration with GlobalFoundries (Nasdaq: GFS) (GF) to develop its portfolio of high-performance radar systems-on-chip (SoC).
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in