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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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Foxconn Makes Its CES Debut, Unveiling Diverse Automotive Electronics Solutions
January 2, 2025 | FoxconnEstimated reading time: 2 minutes
FIH, a subsidiary of Hon Hai Technology Group (Foxconn) will make its CES debut in Las Vegas from January 7 to 10, 2025, showcasing its wide-ranging automotive electronics solutions. In response to the growing complexity and diversity of in-vehicle applications, FIH leverages its expertise in the ICT industry and hardware-software integration capabilities to help accelerate the advancement of the automotive industry.
FIH Vice President Dr. Wen Kuo stated, "FIH is committed to innovation in automotive electronics. At CES 2025, we will present our advanced solutions that demonstrate FIH’s capabilities in independent design, high-quality manufacturing, and system integration capabilities. Moving forward, we are committed to deepening our engagement in the ecosystem and further strengthening collaboration with industry partners to drive the evolution of the automotive industry, creating a safer and smarter driving experience."
Key products featured at the exhibition include 4G and 5G Telematics Control Units (TCU) and In-Vehicle Infotainment (IVI) system. Both 4G and 5G TCUs are equipped with eCall functionality and offer different antenna options to accommodate all vehicle stylish requirements, including Conformal Antenna, Shark Fin Antenna, and External Antenna. The IVI system boasts a 44.8-inch large screen and directional speakers, offering a personalized, undisturbed entertainment experience for both the driver and the front-seat passenger.
In addition, FIH will showcase its High-Performance Computing (HPC) and Advanced Driver Assistance Systems (ADAS), revealing its progress in advanced automotive solutions. The HPC serves as a key enabler of software-defined vehicles, which can streamline the traditional architecture of deploying multiple distributed ECUs and lay the foundation for adopting more advanced features in the future. The ADAS system, equipped with a high-definition camera and advanced AI for object recognition and vehicle control decisions, provides a safer smart driving experience.
FIH has made great strides in the automotive electronics field in recent years. In 2024, its TCU received ASPICE CL2 certificate, demonstrating its ability to meet international standards for automotive hardware and software development. Moving forward, FIH will continue to implement its "2+2" strategy, promoting industries focused on automotive electronics and robotics and technologies related to artificial intelligence and next-generation communications. Through its global operation footprint and agile strategies, FIH can quickly to respond to market demands and create greater value to its customers.
Welcome to visit us at Booth No. 4374, West Hall, Las Vegas Convention Center.
FIH will make its CES debut from January 7 to 10, showcasing its automotive electronics solutions.
CES 2025
FIH Exhibition Information:
Dates: January 7 to January 10, 2025 (Tuesday to Friday)
Location: Las Vegas Convention Center, the US
Booth Number: No.4374
Testimonial
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Klaus Koziol - atgSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
Green Circuits Heads to Peterson SFB to Support Next-Gen Space and Defense Electronics
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Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
05/06/2026 | Michael Carano -- Column: Trouble in Your TankThere is no question that the electronics industry, especially in circuit board design and fabrication, advanced packaging, and innovation throughout the value chain, has seen a significant transformation, whether it be in materials, system architecture, HDI and ultra HDI, semiconductors, or chiplets. AI and high-performance computing (HPC) are driving change across several fronts, including material properties, assembly techniques (think hybrid bonding), and power management.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.