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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Micron Appoints Mike Cordano as Executive VP of Worldwide Sales
January 6, 2025 | MicronEstimated reading time: 2 minutes
Micron Technology, Inc. announced it is appointing Mike Cordano as the company’s executive vice president of worldwide sales, effective immediately. Cordano will succeed Mike Bokan, who announced a few months ago his intention to retire from Micron in fiscal 2025 after more than twenty-eight years with the company. Bokan will support Cordano over the next several months to ensure a seamless transition. Cordano will report directly to Sanjay Mehrotra, President and CEO of Micron.
Cordano joins Micron with a 30-year track record of success in executive leadership, driving innovative business development, and executing successful go-to-market strategies. His experience includes over 8 years at Western Digital (WD), where he held ever-increasing executive positions, including President and Chief Operating Officer and President of the Hitachi Global Storage Technology (HGST) subsidiary. Immediately before the acquisition by WD, he held the position of Executive Vice President of Sales and Marketing at HGST. Most recently, he was the Founder and Partner of Prime Impact Capital.
“Mike Cordano’s comprehensive experience and growth mindset makes him a valuable leader to continue our collaboration with customers as memory becomes more critical to technology innovation,” said Mehrotra. “I am confident that under Mike’s leadership, Micron will leverage the strongest competitive position in our history to reach new heights. I am excited to welcome Mike to Micron.”
“I want to thank Mike Bokan for his many years of dedication and strong contributions to Micron’s growth and success,” said Mehrotra. “In our most recent fiscal quarter, Mike and his sales team helped deliver record revenue for Micron. On behalf of all Micron team members, I wish him many years of health and happiness in his retirement.”
“Micron is a proven industry leader that is playing a critical role in the expansion of AI,” said Cordano. “Mike Bokan and his sales organization have a strong record of performance, and I am excited to join Sanjay, his leadership team, and Micron team members to continue the growth trajectory in the coming years.”
Cordano is a member of the Leeds School of Business's board of advisors at the University of Colorado. He holds a Bachelor of Science in Business Administration and Management from the University of Colorado.
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Rachael Temple - AlltematedSuggested Items
KYZEN to Highlight MICRONOX MX2123 Power Module Cleaner at IMAPS Wire Bonding Workshop
04/29/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (IMAPS) Wire Bonding 2026 Workshop and Tabletop Exhibition, scheduled to take place May 12-13 at the Crowne Plaza Boston-Woburn in Woburn, MA.
Companion Guide to Popular UHDI Podcast Series Now Available for Download
03/23/2026 | I-Connect007The companion guide to On the Line With…American Standard Circuits: Ultra High Density Interconnect (UHDI) explores how UHDI is reshaping PCB design and manufacturing. As trace widths shrink from 25 microns toward 5 microns, UHDI enables finer geometries, tighter impedance control, improved RF performance, and reduced layer counts.
Micron Celebrates Opening of India’s First Semiconductor Assembly and Test Facility
03/02/2026 | Globe NewswireMicron Technology, Inc. celebrated the grand opening of its semiconductor assembly and test facility in Sanand, Gujarat, India.
Lam Research Expands Boise Investment to Support U.S. Chip Growth
02/18/2026 | PRNewswireIn a ribbon-cutting ceremony, Lam Research Corp. commemorated the opening of its new office in Boise, Idaho, joined by U.S. Senator Jim Risch, representatives of Micron Technology, Inc. and other distinguished local government, community, and academic leaders.
EIPC Winter Conference Review: From Innovation to Qualification
02/13/2026 | Pete Starkey, I-Connect007Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”