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Unimicron Wins 17th Taiwan Corporate Sustainability Award

01/31/2025 | Unimicron
Unimicron (3037) has been adhering to a stable management and sustainability concept, promoting corporate sustainability actions, and actively playing a core role in the ESG wave.

KYZEN to Feature MICRONOX MX2123 Power Module Cleaner at iMAPS Wire Bonding Workshop

01/22/2025 | KYZEN'
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (iMAPS) Wire Bonding 2025 Workshop and Tabletop Exhibition, scheduled to take place February 3-4 at the Westin San Diego Bayview.

The Pulse: Ultra Upgrade Unknowns—What’s Coming for UHDI?

01/21/2025 | Martyn Gaudion -- Column: The Pulse
As we enter the second quarter of the 21st century, there appears to be a new chapter in PCB technology. Ultra high density interconnect (UHDI) has become a buzzword, but it’s actually not that new; many of the processes were already established in the high-volume production of Asian cell phones and tablets. What is new and challenging, however, is migrating the line widths and stackups—once the domain of handheld consumer products—into the lower volume specialized environment of the commercial world.

Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore

01/10/2025 | Micron
Micron Technology, Inc. broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current facilities in Singapore.

American Standard Circuits' John Johnson to Speak at Ultra HDI Symposium

01/06/2025 | American Standard Circuits
Anaya Vardya, president and CEO of American Standard Circuits, announced that his company’s Director of Quality/Advanced Technology, John Johnson, will be speaking at this year’s Ultra HDI Symposium, Jan. 23, in Peoria, Arizona.
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