Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
Fresh PCB Concepts: PCB Stackup Strategies—Minimizing Crosstalk and EMI for Signal Integrity
Connect the Dots: Designing for Reality—Solder Mask and Legend
SMTA Announces Wafer-Level Packaging Symposium Program
January 8, 2025 | SMTAEstimated reading time: 1 minute
The SMTA is excited to announce the technical program for the 2025 Wafer-Level Packaging Symposium. The symposium will be held February 18-20, 2025 at The Hyatt Regency San Francisco Airport in San Francisco, California.
The technical program features a special keynote presentation. On Wednesday, February 19, 2025, Eric Breckenfeld, Nvidia, and Erik Hadland, Semiconductor Industry Association, will co-present, “The CHIPS and Science Act: Past, Present and Future of U.S. Microelectronics R&D.”
Technical sessions include over 20 expert speakers who delve into wafer-level packaging advances, assembly/integration process, novel interconnect & packaging process and materials, substrate/integration platform, test & metrology, fan-out wafer-level packaging, and more. The program features presentations from leading companies including adeia, Nvidia, NHanced Semiconductors, Semiconductor Industry Association, and universities such as Hanyang University, Yokohama National University, and more.
The symposium kicks off with two professional development courses on Tuesday, February 18, 2025. The first course, “Materials for Semiconductor Packaging,” will be instructed by Terry Alford, Arizona State University. Gamal Refai Ahmed, Ph.D., AMD, will instruct the second course, “Current & Future Challenges and Solutions in AI & HPC System & Thermal Management.” Access to these courses is included in standard registration.
Registration for this event is open. Click here to register. Discounted rates are available by registering on or before January 27, 2025. All presentations, professional development courses and events open to attendees are included in registration.
Share on:
Suggested Items
Eighteen New Semiconductor Fabs to Start Construction in 2025
01/08/2025 | SEMIThe semiconductor industry is expected to start 18 new fab construction projects in 2025*, according to SEMI’s latest quarterly World Fab Forecast report. T
Global Semiconductor Sales Increase 20.7% Year-to-Year in November
01/08/2025 | SIAThe Semiconductor Industry Association (SIA) announced global semiconductor sales hit $57.8 billion during the month of November 2024, an increase of 20.7% compared to the November 2023 total of $47.9 billion and 1.6% more than the October 2024 total of $56.9 billion. Monthly sales are compiled by the World Semiconductor.
Marcy LaRont Named I-Connect007 Executive Director
01/08/2025 | IPCMarcy LaRont, a printed circuit board (PCB) industry veteran who has been working as the managing editor for PCB007 Magazine this past year, has been named executive director of the I-Connect007 group of publications, which was purchased by IPC in 2022.
EMS Providers Should ‘Plan Prudently’ in 2025
01/08/2025 | Nolan Johnson, SMT007 MagazineDennis Reed is a senior research analyst who specializes in electronics manufacturing at Edgewater Research, a leading research and market intelligence firm covering a mix of compute—CPU, GPU, memory, both flash and DRAM, and hard drive—and insights on components which includes broad line semiconductor, IP&E distribution, and channels.
SMTA UMW Chapter Kicks Off 2025 with 'Manufacturing by Design is the New DFM' Technical Session
01/06/2025 | SMTAThe Upper Midwest Chapter (UMW) of the Surface Mount Technology Association (SMTA) is excited to announce its first technical session of 2025, featuring industry expert Dale Lee presenting "Manufacturing by Design is the New DFM."