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Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics

05/07/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
In electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.

HyRel Technologies Celebrates Future Innovators: Intern Program Empowers the Next Generation of Engineers and Professionals

05/01/2025 | HyRel
HyRel Technologies, a global provider of quick turn semiconductor modification solutions, is proud to spotlight its 7th class of interns in partnership with Peoria Unified School District, featuring three outstanding young women who are already making meaningful contributions to the company's innovative engineering and operations efforts.

BEST Inc to Host Soldering 101 Workshop at Illinois & Michigan Locations

04/15/2025 | BEST Inc.
BEST Inc., a leader in electronic component services, training, and products is pleased to announce it will host multiple Soldering 101 workshops in its Rolling Meadows, Illinois and Lansing, Michigan locations.

Thales & Saildrone Integrate Blue Sentry Array with Uncrewed Systems

04/07/2025 | Thales
Thales Australia and Saildrone announce successful integration of the Thales Blue Sentry array and Saildrone’s uncrewed systems. A potent new national security capability, now proven at sea

Increase in Share Capital and Number of Shares in HANZA

04/03/2025 | HANZA
On March 3, HANZA completed the acquisition of Leden Group Oy. Part of the purchase price consisted of 2,300,000 newly issued shares in HANZA AB.
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