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Sony Honda Mobility, Qualcomm Extend Technology Collaboration to Bring GenAI Capabilities to Future Vehicles
January 10, 2025 | Qualcomm Technologies, Inc.Estimated reading time: 2 minutes
Sony Honda Mobility Inc. (SHM) and Qualcomm Technologies, Inc. have announced the expansion of their technology collaboration to integrate the latest generation of Snapdragon® Digital Chassis™ solutions into its future AFEELA vehicles, marking a significant advancement in the development of software-defined vehicles (SDVs). The next phase of this collaboration aims to enhance the next generation of AFEELA vehicles with cutting-edge features, including edge generative artificial intelligence (GenAI) for more intuitive and personalized in-car experiences, advanced driver assistance systems (ADAS), and seamless connectivity powered by Qualcomm Technologies’ comprehensive, cloud-connected Snapdragon Digital Chassis solutions. The companies' expanded relationship underscores Sony Honda Mobility and Qualcomm Technologies’ continued commitment to delivering state-of-the-art technology and unparalleled user experiences in the automotive industry.
This expanded collaboration between SHM and Qualcomm Technologies is set to redefine SHM’s vision by delivering AFEELA vehicles that are smart, connected, and truly reflective of Sony's legacy in high-quality entertainment and Honda's commitment to automotive excellence. Together, SHM and Qualcomm Technologies are paving the way for a future where technology and mobility seamlessly converge, providing drivers and passengers with a next-generation automotive experience.
The First AFEELA vehicles equipped with Snapdragon Digital Chassis solutions are expected to start deliveries in 2026. Reservations will be available this year.
Snapdragon Digital Chassis platforms for AFEELA vehicles:
- The Snapdragon® Cockpit Platform powers AFEELA's in-vehicle entertainment and cockpit, delivering high-quality audio and rich 3D visual experiences to enable enjoyable and immersive moments in the car, whether you're listening to music, watching a movie, or playing a game. Leveraging the platform’s support for GenAI capabilities, SHM will transform the cabin into a digital haven, offering personalized content and AI enabled interactive features that enhance the driving and passenger experience.
- Snapdragon® Auto Connectivity Platforms offer robust, security-rich connectivity for infotainment systems and precise positioning to enable secure vehicle connection, providing comprehensive access to entertainment, navigation, and other digital services.
- Snapdragon® Ride Platform provides AFEELA with an open and customizable solution for developing advanced driver assistance system (ADAS) features. This platform offers flexibility with low power and high throughput and a production-grade toolchain for AI integration and data handling. The Snapdragon Ride solution is designed with safety and advanced automation in mind, enabling the creation of sophisticated systems that offer a smooth, automated driving experience.
“Our collaboration with Sony Honda Mobility underscores our unwavering commitment to advancing automotive technology for next-generation vehicles,” said Nakul Duggal, group general manager, automotive, industrial, and loud, Qualcomm Technologies, Inc. “We are thrilled to strengthen our relationship by equipping upcoming AFEELA vehicles with cutting-edge technologies like GenAI, delivering premium, sophisticated, and safety-rich riding experiences that redefine the future of mobility.”
"By integrating Qualcomm Technologies’ Snapdragon Digital Chassis and GenAI into our AFEELA brand, we are taking a significant step towards realizing our vision of software-defined vehicles,” said Izumi Kawanishi, representative director, president, chief operating officer, Sony Honda Mobility. “This relationship allows us to offer our customers a seamless and connected driving experience, combining the best of automotive and digital innovation, and transforming the mobility space into an entertainment space.”
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Ynvisible Expands into South America Through Strategic Collaboration with ED Technologies
10/22/2025 | Ynvisible Interactive Inc.Ynvisible Interactive Inc., a leading provider of printed low-power e-paper display products, is pleased to announce a strategic partnership with ED Technologies to support market development across South America, with an initial focus on Brazil.
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10/14/2025 | Wurth ElektronikWürth Elektronik is a partner in the visionary EU project PROACTIF, funded under the Chips Joint Undertaking (Chips JU). The international consortium of 42 partners from 13 countries aims to strengthen Europe’s technological sovereignty i
Dymax to Address Key Electronics Assembly Challenges with Light-Cure Solutions at SMTA International 2025
10/09/2025 | DymaxDymax, a global manufacturer of light-curing materials and equipment, will exhibit at SMTA International 2025 in Rosemont, Illinois, October 21–23. Visit booth 2834 to see how Dymax technologies protect components from harsh environments, help meet regulatory requirements, and streamline assembly.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
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