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Current IssueThe Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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IPC Announces New Training Course: PCB Design for Manufacturability
January 10, 2025 | IPCEstimated reading time: Less than a minute
IPC announced the launch of a new training course: PCB Design for Manufacturability.
This three-week online program, taught by an industry expert with over 40 years of experience, is designed to equip PCB designers with the knowledge and skills to reduce or eliminate design, documentation, and capability issues that often arise during PCB fabrication.
Key Learning Objectives:
- Understand the importance of Design for Manufacturability (DFM) in the PCB design process.
- Learn how to identify and address potential manufacturing challenges early in the design phase.
- Gain a comprehensive understanding of PCB fabrication processes and capabilities.
- Develop best practices for creating manufacturable PCB designs.
Course Content:
- DfM Course Introduction, Fabricator Capability and Materials
- Panelization, Stackups and Surface Finishes
- Conductive Features, Holes/Vias and Other Mechanical Features
- Masks and Inks, Impedance and Signal Loss, and Electrical Test
- FPC, Documentation and Specifications
Participants will receive valuable resources, including:
- PCB Fabrication Design Rules: An editable document to help designers avoid common design issues and ensure compatibility with fabricator capabilities.
- Rigid PCB Fabrication Acceptance Specification: An editable document outlining recommended qualification and performance specifications for all IPC-6012 requirements.
Course Dates:
February 11, 2025 – February 27, 2025
Tuesdays and Thursdays, 12:00 PM – 2:00 PM CST
Registration: click here.
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January 2025 Issue of Design007 Magazine: The Designer of the Future
01/13/2025 | I-Connect007 Editorial TeamAs we enter the new year, it’s a great time to be a PCB designer. The job is more complex than ever, and a lot of fun too. We can only wonder what the PCB designers of 1975 would think about the typical PCB designer’s workday. What will the designers' job be like for the next generations?
The Shaughnessy Report: The Designer of Tomorrow
01/14/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s a great time to be a PCB designer. The job is more complex than ever, but it's also a lot of fun. We can only wonder what the PCB designers of 1975 would think about today’s typical workday. What will the designer's job look like in the future? There has been a move toward working remotely, driven partly by the COVID pandemic and partly by reality: Many experienced designers simply will not relocate, even for a more lucrative job.
Focus on electronica: Future Challenges From a Designer’s Viewpoint
01/09/2025 | I-Connect007 Editorial TeamThomas Romont is CEO of WorldWide Electronic Circuits in Nantes, France, and chair of the IPC Designers Council France. He gave a presentation at electronica titled Challenges for the Future From a PCB/PCBA Designer Perspective. We asked Thomas to share his thoughts about the class, why this topic is so important, and what he hoped attendees would take away from his class.
Siemens, Sony Deliver Breakthrough Immersive Engineering for the Industrial Metaverse
01/09/2025 | Siemens Digital IndustriesSiemens Digital Industries Software, in collaboration with Sony Corporation, announced today that it is delivering on its next-generation immersive engineering roadmap that brings together Siemens’ NX software for product engineering with Sony’s breakthrough head-mounted display (HMD) to enable the industrial metaverse.