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IPC Announces New Training Course: PCB Design for Manufacturability

01/10/2025 | IPC
This three-week online program, taught by an industry expert with over 40 years of experience, is designed to equip PCB designers with the knowledge and skills to reduce or eliminate design, documentation, and capability issues that often arise during PCB fabrication.

Focus on electronica: Future Challenges From a Designer’s Viewpoint

01/09/2025 | I-Connect007 Editorial Team
Thomas Romont is CEO of WorldWide Electronic Circuits in Nantes, France, and chair of the IPC Designers Council France. He gave a presentation at electronica titled Challenges for the Future From a PCB/PCBA Designer Perspective. We asked Thomas to share his thoughts about the class, why this topic is so important, and what he hoped attendees would take away from his class.

Siemens, Sony Deliver Breakthrough Immersive Engineering for the Industrial Metaverse

01/09/2025 | Siemens Digital Industries
Siemens Digital Industries Software, in collaboration with Sony Corporation, announced today that it is delivering on its next-generation immersive engineering roadmap that brings together Siemens’ NX software for product engineering with Sony’s breakthrough head-mounted display (HMD) to enable the industrial metaverse.

IPC: PCB Designers Invited to Attend PEDC-Pan-European Electronics Design Conference

12/30/2024 | IPC
The Pan-European Electronics Design Conference (PEDC), co-hosted by FED and IPC, will take place on January 29-30, 2025. This two-day conference, held in English, will bring together global PCB designers for a comprehensive exchange of ideas and insights on the latest trends and technologies in electronics design.

Effects of Advanced Packaging and Stackup Design

12/26/2024 | I-Connect007 Editorial Team
Kris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
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