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Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
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January 2025 Issue of Design007 Magazine: The Designer of the Future
January 13, 2025 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
The Designer of the Future
As we enter the new year, it’s a great time to be a PCB designer. The job is more complex than ever, and a lot of fun too. We can only wonder what the PCB designers of 1975 would think about the typical PCB designer’s workday. What will the designers' job be like in the future?
In the January 2025 issue of Design007 Magazine, our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Suggested Items
IPC Announces New Training Course: PCB Design for Manufacturability
01/10/2025 | IPCThis three-week online program, taught by an industry expert with over 40 years of experience, is designed to equip PCB designers with the knowledge and skills to reduce or eliminate design, documentation, and capability issues that often arise during PCB fabrication.
Focus on electronica: Future Challenges From a Designer’s Viewpoint
01/09/2025 | I-Connect007 Editorial TeamThomas Romont is CEO of WorldWide Electronic Circuits in Nantes, France, and chair of the IPC Designers Council France. He gave a presentation at electronica titled Challenges for the Future From a PCB/PCBA Designer Perspective. We asked Thomas to share his thoughts about the class, why this topic is so important, and what he hoped attendees would take away from his class.
Siemens, Sony Deliver Breakthrough Immersive Engineering for the Industrial Metaverse
01/09/2025 | Siemens Digital IndustriesSiemens Digital Industries Software, in collaboration with Sony Corporation, announced today that it is delivering on its next-generation immersive engineering roadmap that brings together Siemens’ NX software for product engineering with Sony’s breakthrough head-mounted display (HMD) to enable the industrial metaverse.
IPC: PCB Designers Invited to Attend PEDC-Pan-European Electronics Design Conference
12/30/2024 | IPCThe Pan-European Electronics Design Conference (PEDC), co-hosted by FED and IPC, will take place on January 29-30, 2025. This two-day conference, held in English, will bring together global PCB designers for a comprehensive exchange of ideas and insights on the latest trends and technologies in electronics design.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”