-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Ensuring Compliance With the U.S. CHIPS Act: Identifying the Source of Electronic Components
January 13, 2025 | Dr. Eyal Weiss, CybordEstimated reading time: 1 minute

The U.S. CHIPS Act aims to strengthen domestic semiconductor manufacturing and enhance supply chain security. As part of this initiative, manufacturers must ensure compliance with specific regulations regarding the sourcing of electronic components. This white paper provides an overview of the compliance requirements, relevant laws and standards, and introduces innovative technological solutions to verify the provenance of electronic components. Moreover, it highlights the importance of comprehensive verification that extends beyond sourcing to include the production stage, finished goods, and semi-finished products. By ensuring that all components are original and have not been tampered with at any point in the supply chain, manufacturers can maintain product integrity and uphold regulatory compliance.
1. Compliance Requirements and Relevant Laws
The CHIPS Act emphasizes the importance of transparency and traceability in the semiconductor supply chain. Essential compliance requirements include:
- Documentation of origin: Companies must maintain detailed records documenting the origin of all electronic components used in production.
- Verification processes: Manufacturers are required to implement processes that ensure the authenticity of the source of their components, reducing reliance on potentially fraudulent documentation.
- Adherence to standards: Compliance with industry standards such as IPC-1752A (Material Declaration Management) and ISO 9001 (Quality Management Systems) is essential for ensuring quality and traceability.
2. Current Solutions: A Trust-Based Approach
Despite the clear regulations, current solutions predominantly rely on trust. Manufacturers depend on paper reports and documentation provided by the supply chain to verify the sources of their components. This approach has significant drawbacks:
- Lack of ground truth: Existing methods do not provide a technological means to obtain ground truth regarding the origins of components. Verification is limited to the accuracy of documents and trust in suppliers.
- Increased risk: The reliance on paperwork increases the risk of fraud and misrepresentation, which can lead to non-compliance and reputational damage.
To continue reading this article, which originally appeared in the January 2025 SMT007 Magazine, click here.
Suggested Items
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
Kasuo Electronics Launches Advanced Testing Laboratory to Strengthen Global Supply Chain Quality Assurance
04/29/2025 | BUSINESS WIREKasuo Electronics Co., Ltd, a globally recognized trader of electronic components, has officially operationalized its state-of-the-art testing laboratory.
QuantumScape, Murata Announce Framework for Ceramics Collaboration
04/25/2025 | BUSINESS WIREQuantumScape Corporation, a global leader in next-generation solid-state lithium-metal battery technology, and Murata Manufacturing Co. have entered into the first phase of an agreement to explore a collaboration for high-volume manufacturing of ceramic film for QS’s solid-state battery technology.
IPC Welcomes Exemptions to Reciprocal Tariffs
04/14/2025 | IPCIPC shared the following statement today on tariff exclusions and their implications on the global electronics industry. This statement can be attributed to Dr. John W. Mitchell, IPC president and CEO:
ASMPT Demonstrates Technology Leadership in SMT Assembly
04/09/2025 | ASMPTThe rapid development of artificial intelligence is driving the demand for high-performance processors and placing great demands on electronics manufacturing.