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TSMC and MediaTek Collaboration Paves the Way for Next-gen Wireless Connectivity

03/13/2025 | TSMC
MediaTek and TSMC announced that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.

Würth Elektronik Now an Infineon ‘Preferred Partner’

03/13/2025 | Wurth Elektronik eiSos
Würth Elektronik, one of the leading manufacturers of electronic and electromechanical components, is broadening its collaboration with semiconductor manufacturers.

Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI

03/12/2025 | Ventec International Group
Ventec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.

Flex Named 2025 World's Most Ethical Companies Honoree for the Third Consecutive Year

03/12/2025 | Flex
Flex announced its recognition as one of the 2025 World's Most Ethical Companies® by Ethisphere, a global leader in defining and advancing the standards of ethical business practices.

INEMI Sessions at IPC APEX EXPO Focus is on Board Assembly and PCB & Laminates

03/12/2025 | iNEMI
If you plan to attend the upcoming IPC APEX EXPO in Anaheim, California, be sure to add the INEMI sessions to your calendar. We will have two forward-looking sessions — one on PCB and Laminates and the other on Board Assembly.
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