American Made Advocacy: Rebuilding America’s Military Stockpiles Begins With Microelectronics
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
Defense Speak Interpreted: Hypersonics Report Back After Six Years of Silence
Teledyne FLIR Defense Awarded $74 Million IDIQ Contract to Modernize U.S. Coast Guard Surveillance Systems
January 13, 2025 | BUSINESS WIREEstimated reading time: 1 minute
Teledyne FLIR Defense, part of Teledyne Technologies Incorporated, announced it has been awarded a five-year Indefinite Delivery Indefinite Quantity (IDIQ) contract worth up to $74.2 million to provide modernized imaging surveillance systems to the United States Coast Guard (USCG).
FLIR Defense will deliver more than 125 Electro-Optic Sensor System-Modernized (ESS-M) systems for use on USCG rotary wing aircraft, specifically the MH-60 and MH-65. The advanced ESS-M platform features a full-HD sensor suite and updated user interfaces, as well as advanced processing capabilities and software enhancements that will support future growth.
The ESS-M systems provide operators with high-definition daylight, low light, and infrared imagery and will be used in support of all Coast Guard missions, with an emphasis on search and rescue, living marine resources, and law enforcement. The new technology also will augment coastal security, drug and migrant interdiction, ports and waterways protection, and other Coast Guard rapid response needs.
Teledyne FLIR Defense has been delivering and supporting legacy ESS systems for USCG medium- and short-range recovery aircraft since 2005.
“The significant updates through ESS-M will enable the U.S. Coast Guard to stay on technology’s cutting edge while conducting its wide range of key maritime operations,” said Dr. JihFen Lei, president of Teledyne FLIR Defense. “We’re proud to extend our history of support and look forward to building our relationship across all missions areas.”
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
OKI Develops 180-Layer, 15 mm PCB for AI Semiconductor Test Equipment
04/29/2026 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) mounted on AI semiconductors.
Ventec Evaluates US Manufacturing Facility to Support North American Growth
04/28/2026 | Ventec International GroupVentec International Group today announced that it is evaluating the potential establishment of a manufacturing facility in the United States to support its growing North American customer base with high-performance laminate and prepreg materials.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
The Chemical Connection: When the Industry Moves Faster Than the Standards
04/29/2026 | Don Ball -- Column: The Chemical ConnectionAs a supplier of wet processing equipment, we have rules and standards we must adhere to, including both regional and national electrical codes and safety and environmental regulations, as well as myriad other standards to make the equipment safe to use. Things are a little different when it comes to rules and standards for manufacturing PCBs, though, because technical advances and requirements change so quickly that standards can’t keep up.
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.