Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Connect the Dots: How to Avoid Five Common Causes of Board Failure
Hot Off the Press: Explore the New Issue of IPC Community
January 14, 2025 | IPC Community Editorial TeamEstimated reading time: 1 minute
The latest digital copy of IPC Community is now ready to view. Each quarter, IPC Community provides exclusive interviews and practical tips on what’s happening with IPC and its members.
What’s in this issue?
Tariff Troubles: What could a new U.S. administration’s tousle with tariffs mean for your business? IPC Chief Economist Shawn DuBravac lays out the scenario.
Student Leadership: Waad Tarman finishes up her term as the Student Board Member. Find out why the future of electronics is in good hands. (Bonus Video: Hear from two of IPC’s Emerging Engineers, who talk about their path into the industry.)
Women in Business: Barbara Pauls and Siti Wahab show that determination and ingenuity—and a belief in yourself—are enough to overcome any challenge. Get takeaways you can implement in your own pursuit of excellence.
Pure Gold: What would IPC be without its A-Teams? Join us as we go behind the scenes of the 2024 Golden Gnome Awards. You’ll meet the IPC tech team who puts this event all together, and find out what makes it so special.
Dynamic Duo: Brian Chislea of Dow and AJ Arriaga of Summit Interconnect embark on a journey of discovery and growth in IPC’s mentorship program.
Around the World: Read features on two of IPC Asia’s biggest trade shows, how China is developing future engineers, an India wire harness company making waves, IPC’s newest sustainability expert Diana Radovan, a review of electronica 2024, sustainability practices, apprenticeships, and so much more.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.