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Hot Off the Press: Explore the New Issue of IPC Community
January 14, 2025 | IPC Community Editorial TeamEstimated reading time: 1 minute

The latest digital copy of IPC Community is now ready to view. Each quarter, IPC Community provides exclusive interviews and practical tips on what’s happening with IPC and its members.
What’s in this issue?
Tariff Troubles: What could a new U.S. administration’s tousle with tariffs mean for your business? IPC Chief Economist Shawn DuBravac lays out the scenario.
Student Leadership: Waad Tarman finishes up her term as the Student Board Member. Find out why the future of electronics is in good hands. (Bonus Video: Hear from two of IPC’s Emerging Engineers, who talk about their path into the industry.)
Women in Business: Barbara Pauls and Siti Wahab show that determination and ingenuity—and a belief in yourself—are enough to overcome any challenge. Get takeaways you can implement in your own pursuit of excellence.
Pure Gold: What would IPC be without its A-Teams? Join us as we go behind the scenes of the 2024 Golden Gnome Awards. You’ll meet the IPC tech team who puts this event all together, and find out what makes it so special.
Dynamic Duo: Brian Chislea of Dow and AJ Arriaga of Summit Interconnect embark on a journey of discovery and growth in IPC’s mentorship program.
Around the World: Read features on two of IPC Asia’s biggest trade shows, how China is developing future engineers, an India wire harness company making waves, IPC’s newest sustainability expert Diana Radovan, a review of electronica 2024, sustainability practices, apprenticeships, and so much more.
Suggested Items
KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics
07/15/2025 | KONIGKONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating system that brings new levels of precision, speed, and material efficiency to electronics manufacturing.
Electronics Manufacturing & Assembly Collaborative (EMAC) Announces Innovative Student Competition
07/15/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced the launch of the Bright Manufacturing Challenge 2025, a revolutionary hands-on competition that transforms how students experience electronics manufacturing and robotics engineering.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.