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Technica Installs CBT/MLI Direct Imaging System at Summit Interconnect Santa Clara
January 14, 2025 | Technica USAEstimated reading time: 1 minute

Technica has recently installed the 6th CBT/MLI Direct Imaging (DI) system at Summit Interconnect's Santa Clara operation, a testament to Summit's ongoing commitment to cutting-edge technology and operational excellence.
This latest acquisition, the TiTAN PSR-H model, brings unparalleled capabilities to their facility:
- Fastest print speed for all photoimageable solder masks, including standard, black, and white masks
- Versatility in handling both dry film and solder mask printing with top-tier front-to-back registration
- Advanced performance, delivering print resolution down to 10 microns, powered by CBT’s patented technology
Alfred Macha, Vice President and GM of Summit-SC stated, "We at Summit-SC are very pleased with the purchase of the TiTAN 8000 PSR-H model. This machine is qualified to print all solder mask colors, including white and black masks. We have also qualified the machine to print inner and outer layer panels with excellent results."
Michael Trammel, Director of Technology Transfer, added, “I was also impressed how quickly we were able to train our staff and integrate the machine into production. Most importantly the machine and the support from Technica has proven to be very reliable.”
Najib Khan, Product/Applications Manager at Technica USA, highlighted, “Summit has been a long-standing partner, and their trust in CBT’s innovative technology underscores our shared vision for growth and success. We’re proud to support Summit’s journey and witness their remarkable achievements over the years.”
With the TiTAN PSR-H, Summit Interconnect and Technica continue to partner and invest in technologies that ensure precision, efficiency, and quality for our customers.
Together, we’re driving advancements in PCB fabrication!
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10/06/2025 | Marcy LaRont, I-Connect007According to Instrumental’s dynamic CEO, Anna-Katrina Shedletsky, the Build Better Electronics Manufacturing Summit on Sept. 30 was a passion project meant to provide a forum for hardware engineering senior leadership, who have very busy jobs and limited opportunities, to share information, thought leadership, and networking opportunities. “Build Better is really about cross-pollination and sharing,” she said, as she highlighted the importance of supporting this type of sharing in tech, which may be more important than ever before.
Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer
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Beyond Recycling: Reshaping Sustainability in Electronics
07/24/2025 | Marcy LaRont, PCB007 MagazineEnvironmental sustainability, especially for carbon-intensive industries like electronics manufacturing, means businesses are often plagued with various reporting requirements that don’t necessarily address the root problem. To that end, SERI and the Global Electronics Association are teaming up to reshape sustainability in electronics.
AI-driven MES Rewriting the Rules of Manufacturing Transformation
07/23/2025 | Francisco Almada Lobo, Critical ManufacturingThe Critical Manufacturing MES & Industry 4.0 International Summit, June 12–13, revealed a profound shift in how manufacturers approach digital transformation. AI-enabled execution systems are no longer a future ambition but are essential for navigating complexity and driving change.