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U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging

01/17/2025 | U.S. Department of Commerce
The U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing.

onsemi Completes Acquisition of Qorvo’s Silicon Carbide JFET Technology Portfolio

01/16/2025 | onsemi
onsemi announced that it has completed its acquisition of the Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business, including the United Silicon Carbide subsidiary, from Qorvo for $115 million in cash.

SIA Releases Policy Recommendations for Trump-Vance Administration and 119th Congress

01/16/2025 | SIA
The Semiconductor Industry Association (SIA) released a policy agenda setting forth the U.S. semiconductor industry’s policy priorities and suggested areas for collaboration with the Trump-Vance administration and the 119th Congress.

ELMOTEC to Showcase SolderSmart® TOP Automated Soldering Equipment at APEX 2025

01/15/2025 | ELMOTEC
E-tronix, a Stromberg Company, is excited to announce that they will partner with ELMOTEC to showcase the SolderSmart® TOP Automated Soldering Equipment at APEX 2025 Booth #1703.

Technica Installs CBT/MLI Direct Imaging System at Summit Interconnect Santa Clara

01/14/2025 | Technica USA
Technica has recently installed the 6th CBT/MLI Direct Imaging (DI) system at Summit Interconnect's Santa Clara operation, a testament to Summit's ongoing commitment to cutting-edge technology and operational excellence.
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