Target Condition: Are Autorouters Friend or Foe?
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
Elementary Mr. Watson: Retro Routers vs. Modern Boards—The Silent Struggle on Your Screen
An Inspiring Journey From Animation to PCB Design
January 20, 2025 | Marcy LaRont, I-Connect007Estimated reading time: 1 minute
I recently spoke with Melissa Martinez, a PCB design student in John Watson’s class at Palomar College. In this interview, Melissa shares her inspiring journey from the world of animation to the realm of printed circuit board design. Introduced to the field by her father, an engineer at Northrop Grumman, she discovered her passion for PCB design through John’s curriculum at Palomar. Her story highlights the importance of mentorship and education in attracting new talent to the industry, encouraging young individuals to explore opportunities they may not yet know exist.
Marcy LaRont: Melissa, you came into this industry through a family connection. What were you doing before learning about PCB design?
Melissa Martinez: I was an animation artist who quickly realized that I was now competing with AI, and I wasn’t earning enough money to compete with that. My father has been an engineer at Northrop Grumman for over 20 years, and I knew it was a secure job with a stable income. I knew nothing about the PCB industry until last year when I asked my father about his job, and he found the classes by John Watson at Palomar College. I took the introductory class followed by John’s advanced class. Ultimately, I took a certification course and will be finishing soon.
To read this entire conversation, which appeared in the January 2025 issue of Design007 Magazine, click here.
Share on:
Suggested Items
Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials
07/02/2025 | Barb Hockaday, I-Connect007In a dynamic and informative Innovation Symposium hosted live and on Zoom on June 25, 2025, representatives from Qnity (formerly DuPont Electronics), DuPont, and Insulectro discussed the evolving landscape of flexible circuit materials. From strategic corporate changes to cutting-edge polymer films, the session offered deep insight into design challenges, reliability, and next-gen solutions shaping the electronics industry.
Target Condition: Are Autorouters Friend or Foe?
07/01/2025 | Kelly Dack -- Column: Target ConditionFor PCB designers, just hearing the word “autorouters” can trigger everything from eye rolls to heated debate. We all have stories—some painful, some comical—of boards gone sideways at the hands of an overzealous routing algorithm. But these tools aren’t going away, and frankly, they shouldn’t. Used wisely, they can save some project teams hours or even days. Used blindly, they can cost weeks. So, where do autorouting tools stand today, and is interactive routing the smarter path forward?
High Density Packaging User Group (HDP) Welcomes Lincstech as New Member
07/01/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
Zhen Ding's 2025 Lean & Digital Initiative Presentation Conference Concludes Successfully, Driving Group Transformation
07/01/2025 | Zhen DingTo advance its digital transformation strategy and embody the CA- PDCA continuous improvement philosophy, Zhen Ding Technology Group (Zhen Ding) successfully hosted the 2025 H1 Lean & Digital Initiative Presentation Conference.
EU Defence Electronics Ecosystem Highlighted in Brussels
07/01/2025 | I-Connect007 Editorial TeamIn this interview, Alison James, senior director of Global Electronics Association—Europe (formerly IPC), discusses the European Defence & Security Summit in Brussels, June 9–13, as well as the first IPC–ASD Europe Defense Electronics Summit, June 10th, which brought together 70 leaders from across the electronics manufacturing supply chain. ASD is the Aerospace, Security and Defence Industries Association of Europe, and co-hosted both the larger and smaller events.