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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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StratEdge Partners with Vitale Engineering as Manufacturer's Representative for Upstate New York
January 22, 2025 | StratEdgeEstimated reading time: 1 minute
StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, has appointed Vitale Engineering as its exclusive Manufacturer’s Representative for Upstate New York. Known for their customer-focused approach and technical expertise, Vitale Engineering will expand access to StratEdge’s cutting-edge packaging technologies across industries such as aerospace, telecommunications, and defense.
“Vitale Engineering’s deep engineering knowledge and commitment to solving complex challenges make them an ideal partner,” said Casey Krawiec, Vice President of Global Sales at StratEdge. “Their ability to foster innovation and connect with clients in Upstate New York will help us better serve customers in this vital region.”
Vitale Engineering specializes in providing tailored solutions for high-tech applications, leveraging decades of expertise in technical sales, product design, and project management. They support industries that demand precision and performance, ensuring customers achieve their goals with innovative and reliable technologies.
“We’re honored to represent StratEdge in Upstate New York,” said Adam Vitale, President of Vitale Engineering. “This partnership allows us to deliver world-class semiconductor packaging solutions to clients who rely on advanced technologies to drive their success. Together, we are poised to address the challenges of high-frequency and high-power applications with unmatched expertise.”
Under this agreement, Vitale Engineering will represent StratEdge’s full line of post-fired and molded ceramic semiconductor packages, which are designed for high-reliability and extreme performance in demanding environments.
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Zuken Launches GENESYS 2026 to Broaden Access and Improve MBSE Workflows
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