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ASMPT Introduces AERO PRO High-Performance Wire Bonder

07/09/2025 | ASMPT
ASMPT, the world’s leading provider of hardware and software solutions for semiconductor and electronics manufacturing, introduces its latest high-performance wire bonder: the AERO PRO.

KYOCERA AVX Releases New 3DB Hybrid Couplers

07/04/2025 | PRNewswire
KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released a new line of integrated thin film (ITF) hybrid couplers designed to facilitate the continued evolution of high-frequency wireless systems in industrial, automotive, telecommunications, and telemetry applications.

Edgewater Wireless Wins Strategic Federal Grant for Advanced Wi-Fi Chip Commercialization

06/30/2025 | BUSINESS WIRE
Edgewater Wireless Systems Inc. the industry pioneer in Wi-Fi Spectrum Slicing technology, is proud to announce it has been awarded $921,000 in non-dilutive funding from FABrIC, the Government of Canada’s flagship initiative to commercialize advanced semiconductor and sensor solutions.

IPC Launches New Wire Harness Design Course Led by Defense Industry Expert

06/03/2025 | I-Connect007 Editorial Team
IPC is expanding its educational offerings with a new online course designed to provide foundational knowledge in wire harness and cable design. The course, Introduction to Wire Harness Design I, is led by a seasoned mechanical engineer and subject matter expert in military cable systems working at FNSS Defense Systems in Turkey.

See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025

05/28/2025 | TopLine
Aerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
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