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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Designing Without a Rulebook: When Engineering Becomes Innovation
May 5, 2026 | Stephen V. Chavez, Siemens EDAEstimated reading time: 1 minute
What if the very rules that made you successful as a PCB designer are the ones now holding you back? This reminds me of walking the floor and attending sessions at both PCB West 2025 and APEX EXPO 2026, where one common theme stood out: More designs with traditional PCB “best practices” simply don’t apply. It’s not because they’re wrong, but because the problems we’re solving have fundamentally changed.
In some cases, those best practices can actually limit performance. This is where PCB design moves beyond optimization and into something far more challenging: designing without a rulebook.
When ‘Best Practices’ Stop Being Best
For most of our careers, PCB design has relied on proven guidelines, rules that ensure manufacturability, signal integrity, and reliability. These practices are built on decades of experience because they work.
But what happens when you’re working on something that hasn’t been done before? This could be designs for:
- Ultra-high-speed interconnects
- AI and HPC hardware pushing extreme bandwidths and power density
- Advanced packaging and heterogeneous integration
- Flexible and hybrid electronics
In these cases, the question shifts from “What’s the right way to do this?” to “Why was it ever done that way, and does it still apply here?” That’s a very different mindset and one that many teams are still learning how to navigate.
To continue reading this article, which appeared in the April 2026 I-Connect007 Magazine, click here.
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Zhen Ding, Chung Yuan University Establish Green AI-PCB Co-Definition Laboratory
05/05/2026 | Zhen DingDriven by global AI demand and the imperative of green sustainability, Zhen Ding Technology Holding Limited held a donation and talent cultivation ceremony with Chung Yuan Christian University (CYCU) to establish the "Green AI-PCB Co-Definition Laboratory."
AdvancedPCB Advances Precision Drilling Capabilities Across Two U.S. Facilities with Schmoll
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PCBAA, AAM Take on the Fight to Rebuild U.S. Manufacturing in New Documentary
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TTM Technologies Reports Sales Growth in Q1 2026
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LPKF Gets Off to a Solid Start in 2026
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