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Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
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I-Connect007 Releases The Printed Circuit Designer’s Guide to... More Secrets of High-Speed PCBs by Martyn Gaudion
January 29, 2025 | I-Connect007Estimated reading time: 1 minute

I-Connect007 is proud to announce the release of The Printed Circuit Designer’s Guide to... More Secrets of High-Speed PCBs, authored by Martyn Gaudion of Polar Instruments. This invaluable resource offers essential insights for anyone involved in the design, procurement, or fabrication of high-speed impedance or insertion loss-controlled PCBs, as well as complex HDI PCBs requiring precise documentation.
A new addition to the acclaimed Printed Circuit Designer’s Guide to… series, this book builds on the principles introduced in Secrets of High-Speed PCBs, Parts 1 and 2. It provides readers with a comprehensive understanding of the challenges in transitioning designs from CAD/CAM systems to real-world manufacturing, where materials, processes, and tolerances often defy idealized specifications.
Key topics covered include:
- Strategies for bridging the gap between design precision and manufacturing realities.
- Best practices for documentation to ensure seamless PCB fabrication.
- Methods to improve signal integrity through precise measurement and modeling.
Written for PCB designers, engineers, and procurement teams, this guide emphasizes how to transition quality designs from prototype to production while maintaining the highest signal integrity standards. With Gaudion’s expertise and practical advice, readers will gain a deeper understanding of the interplay between design specifications and the complex realities of manufacturing processes.
Available Now! Discover how to elevate your PCB design and fabrication process. Learn more and download your copy here.
I-Connect007’s Printed Circuit Designer’s Guide to… series is a trusted collection of educational resources tailored for printed circuit board industry professionals. Equip yourself with the knowledge to design and deliver exceptional high-speed PCBs.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/09/2025 | Andy Shaughnessy, Design007 MagazineTrade show season is wrapping up as we head into summer. Where has the time gone? I hope you all get the chance to take a vacation this year, because I know you’ve earned one. Speaking of which, when was my last vacay? If I can’t remember, it’s probably time for one. It’s been a busy week in electronics, with fallout from the back-and-forth on tariffs taking up most of the oxygen in the room. We have quite an assortment of articles and columns for you in this installment of Must-Reads. See you next time.
Imec Coordinates EU Chips Design Platform
05/09/2025 | ImecA consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform.
New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial TeamWhy is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.