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Connect the Dots: How to Avoid Five Common Causes of Board Failure
The Future of Electronics Manufacturing in APAC
January 30, 2025 | Daniel Schmidt, MKS' ATOTECHEstimated reading time: 1 minute
The Asia-Pacific (APAC) region is solidifying its leadership in electronics manufacturing, fueled by significant new investments from global industry leaders. This growth is driven by surging demand for high-performance components in key sectors like AI, autonomous vehicles, and sustainable energy, making strategic innovation in semiconductors and advanced electronics essential. APAC's strong supply chains further enhance its appeal to investors.
Transforming Electronics Manufacturing
The electronics industry's shift to 3D heterogeneous integration—assembling chips on organic substrates—is driving demand for new materials, processes, and technologies. This innovation, combined with the industry's increasing presence in APAC, leverages the region's robust manufacturing capabilities and investment opportunities, positioning it for substantial growth.
Meeting the Challenges of Advanced Technologies
The rise of AI, renewable energy systems, and autonomous vehicles has created a demand for components that are faster, smaller, and capable of handling immense data loads. Essential for miniaturization and high-speed applications, next-generation technologies using electrochemical deposition for advanced semiconductor packaging, semi-additive processing (SAP) for package substrates, or modified SAP (mSAP) at the printed circuit board level enable the much finer feature sizes required for increased density and fast signaling. In addition, advanced materials such as glass substrates are contributing to this trend, enabling finer feature sizes with improved signal integrity, which is critical for high-performance systems.
Read the rest of this article in the January 2025 issue of PCB007 Magazine.
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