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Rehm Thermal Systems: Future Technologies for Coating, Dispensing and Vapour Phase Soldering Live at IPC APEX EXPO 2025
February 4, 2025 | Rehm Thermal SystemsEstimated reading time: 2 minutes

IPC APEX EXPO 2025, which takes place from 18 to 20 March at the Anaheim Convention Center in California, is the largest and most important trade fair for electronics manufacturing in North America. With its unique combination of a leading technology exhibition, high-calibre conferences and professional training opportunities, the event offers an ideal platform for trade visitors from the entire industry – and is now in its 25th year. True to this year's motto "Reimagine the Possibilities", Rehm Thermal Systems has driven forward the further development of its system solutions in the areas of condensation soldering, coating and dispensing and found new approaches for more economical vapour phase soldering and more flexible automated coating and dispensing applications.
At booth 646, the Rehm experts will be demonstrating the wide range of applications live on the ProtectoXC, our dispensing and coating system, and will inform you about the more economical vapour phase soldering with the Condenso Series thanks to the integrated closed-loop system.
Flexible Coating and Dispensing Options with the Protecto Series
Conformal coating has become an integral part of modern manufacturing, as the protective coating is used to reliably protect electronic assemblies from aggressive environmental influences. With the Protecto Series, Rehm Thermal Systems offers a system that is not only used for automated coating, but also for bonding, sealing and fixing:
With the applicators for the Protecto systems, you can apply up to four different materials “on the fly“ directly. The systems can be operated using the ViCON Protecto software, which fulfils all the requirements of modern, networked and, above all, future-oriented electronics production: intuitive and user-friendly operating elements make it quick and easy to create painting images. It is also easy to access the software with different devices.
Secure your competitive advantage with the Protecto Series and react quickly to market changes and individual customer requirements in the areas of coating and dispensing thanks to the wide range of possible applications.
Resource-saving Vapour Phase Soldering with the Condenso Series
Soldering under vacuum has been a proven technique for decades in vapour phase soldering systems to significantly reduce air inclusions in solder joints. With the closed-loop system for the injected Galden® medium integrated in the vapour phase soldering systems of the Condenso Series, Rehm Thermal Systems has found a future-proof solution for more economical vapour phase soldering:
After soldering, the vacuum and/or cooling process starts. At the same time, the process gas is extracted and purified. A vacuum is created during extraction, which guarantees rapid drying of the solder and process chamber, thus minimising losses when the products are discharged. The extracted Galden® is filtered and cleaned of impurities using granules. This allows approx. 99.9 percent of the medium to be recovered. The purified liquid is stored in a container at room temperature and made available for further processes. This means that no evaporation and energy losses occur. The hermetic sealing of the process chamber (also a vacuum chamber) also prevents evaporation losses during soldering.
The closed-loop system of the Condenso Series effectively supports you in more economical vapour phase soldering with lower production costs thanks to lower Galden® consumption, minimal maintenance and fewer production errors.
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Brent Fischthal - Koh YoungSuggested Items
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.
Indium to Highlight Energy-Efficient, High-Reliability Solder Solutions for EV and Electronics at Productronica India
09/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at Productronica India, to be held September 17-19 in Bengaluru, India.
Altus Supports Datalink Electronics with Advanced Selective Soldering Solution to Boost Manufacturing Efficiency
09/02/2025 | Altus GroupDatalink Electronics has partnered with Altus Group to integrate a cutting-edge automated soldering solution, enhancing its production capabilities and reinforcing its strategic focus on quality, automation, and scalability.
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.