-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Delvitech to Officially Present Hybrid AOI + SPI Horus System at IPC APEX EXPO 2025
February 6, 2025 | DelvitechEstimated reading time: 1 minute

Delvitech is happy to announce that it will showcase its groundbreaking Horus system, the industry's first all-in-one AI native platform for both Automatic Optical Inspection (AOI) and Solder Paste Inspection (SPI), at the upcoming IPC APEX EXPO 2025. The event is scheduled from March 18 to 20, 2025, at the Anaheim Convention Center in Anaheim, California.
Horus represents a revolutionary hybrid 3D inspection solution driven by Artificial Intelligence, capable of conducting both Automatic Optical Inspection (AOI) and Solder Paste Inspection (SPI). Built on proprietary neural networks, it overcomes the limitations of traditional systems, adapting to the diverse variations that arise during production. This advanced technology enables Delvitech to offer an unparalleled inspection solution that integrates effortlessly into every aspect of Surface Mount Technology (SMT) production, redefining inspection processes with unmatched precision and efficiency.
Key Features of the Horus System:
- Unified Recipe Import: The system imports a comprehensive inspection recipe encompassing all production processes
- User-Friendly Interface: Features dedicated tabs for PASTE, PLACEMENT, and REFLOW, each displaying relevant data for streamlined inspections
- Advanced Inspection Capabilities: Offers specialized inspection steps within each process
- Defect Visualization: Detected paste defects are displayed in the Verification Station interface together with components defects, for thorough analysis
Delvitech's proprietary neural network technology minimizes manual configuration by independently identifying and defining PCB components with exceptional accuracy. This approach reduces false positives and ensures unmatched precision across various PCB types and production stages.
Attendees of IPC APEX EXPO 2025 are invited to visit Delvitech's at booth number 846 to experience live demonstrations of the Horus system and learn more about its innovative features.
For more information about the event, please visit the official IPC APEX EXPO website.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.