The Shaughnessy Report: Showing Some Constraint
Elementary, Mr. Watson: Rein in Your Design Constraints
Target Condition: Are Autorouters Friend or Foe?
Delvitech to Officially Present Hybrid AOI + SPI Horus System at IPC APEX EXPO 2025
February 6, 2025 | DelvitechEstimated reading time: 1 minute
Delvitech is happy to announce that it will showcase its groundbreaking Horus system, the industry's first all-in-one AI native platform for both Automatic Optical Inspection (AOI) and Solder Paste Inspection (SPI), at the upcoming IPC APEX EXPO 2025. The event is scheduled from March 18 to 20, 2025, at the Anaheim Convention Center in Anaheim, California.
Horus represents a revolutionary hybrid 3D inspection solution driven by Artificial Intelligence, capable of conducting both Automatic Optical Inspection (AOI) and Solder Paste Inspection (SPI). Built on proprietary neural networks, it overcomes the limitations of traditional systems, adapting to the diverse variations that arise during production. This advanced technology enables Delvitech to offer an unparalleled inspection solution that integrates effortlessly into every aspect of Surface Mount Technology (SMT) production, redefining inspection processes with unmatched precision and efficiency.
Key Features of the Horus System:
- Unified Recipe Import: The system imports a comprehensive inspection recipe encompassing all production processes
- User-Friendly Interface: Features dedicated tabs for PASTE, PLACEMENT, and REFLOW, each displaying relevant data for streamlined inspections
- Advanced Inspection Capabilities: Offers specialized inspection steps within each process
- Defect Visualization: Detected paste defects are displayed in the Verification Station interface together with components defects, for thorough analysis
Delvitech's proprietary neural network technology minimizes manual configuration by independently identifying and defining PCB components with exceptional accuracy. This approach reduces false positives and ensures unmatched precision across various PCB types and production stages.
Attendees of IPC APEX EXPO 2025 are invited to visit Delvitech's at booth number 846 to experience live demonstrations of the Horus system and learn more about its innovative features.
For more information about the event, please visit the official IPC APEX EXPO website.
Share on:
Suggested Items
KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics
07/15/2025 | KONIGKONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating system that brings new levels of precision, speed, and material efficiency to electronics manufacturing.
Electronics Manufacturing & Assembly Collaborative (EMAC) Announces Innovative Student Competition
07/15/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced the launch of the Bright Manufacturing Challenge 2025, a revolutionary hands-on competition that transforms how students experience electronics manufacturing and robotics engineering.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.