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UHDI Fundamentals: UHDI Bleeding-edge Entertainment Applications, Part 2
February 6, 2025 | Anaya Vardya, American Standard CircuitsEstimated reading time: Less than a minute

Ultra high density interconnect (UHDI) technology is revolutionizing bleeding-edge entertainment applications by enabling compact, high-performance devices that push the boundaries of immersion, interactivity, and realism. Part 2 focuses on how UHDI is advancing the entertainment industry, particularly gaming:
Virtual reality (VR) and Augmented Reality (AR) in Gaming Systems
VR and AR experiences demand high performance in compact devices. UHDI supports:
- Miniaturized optics and display controllers: Facilitating lightweight, ergonomic headsets.
- High-speed processing for low latency: Essential for seamless motion tracking and real-time rendering.
- Integrated sensors and cameras: Enabling depth perception, spatial tracking, and hand gestures.
- Wireless modules for untethered use: Compact UHDI-based circuits enable high-speed, low-latency communication.
Gaming consoles and PCs are leveraging UHDI to deliver cutting-edge performance:
- Integrated GPUs and CPUs: High-density circuits for real-time ray tracing and AI-driven graphics.
- Compact cooling systems: UHDI designs support high-performance hardware in slimmer devices.
- High-speed interfaces: Supports ultra-fast storage and data transfer for seamless gameplay.
- Portable gaming devices: Miniaturized UHDI designs make powerful handheld systems possible.
To continue reading this article, which originally appeared in the January 2025 issue of Design007 Magazine, click here.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
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Are Domestic Assemblers Ready for the Next Level of Electronics Miniaturization?
02/19/2025 | Chrys Shea, SHEA Engineering ServicesUHDI technology is more than another evolutionary level of miniaturization. It’s a fundamental change in how we create circuit boards, on a scale potentially as impactful as the transition from through-hole to surface mount was 40 years ago.
Happy’s Tech Talk #37: New Ultra HDI Materials
02/03/2025 | Happy Holden -- Column: Happy’s Tech TalkSome new materials have been introduced in the past year for ultra high density interconnect (UHDI), a convenient title for developing high density technologies. They have received labels like semiconductor-like PCBs (SLPs), redistribution layers (RDL), flip-chip ball grid array (FCBGA), and interposers. The early 2000s saw the creation of these organic substrates for flip-chip IC packaging. The initial construction was composed of a BT core with build-up layers of the Ajinomoto Build-up Film (ABF)