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Powering the Future: Why True Ceramic Circuits Are Not Just ‘Better PCBs’

05/20/2026 | Brian Buyea -- Column: Powering the Future
There’s a dangerous misconception among engineers who still think ceramic circuits are just a little tougher version of a PCB, a little better at handling heat, and a premium option when FR-4 starts to struggle. That thinking will cost you performance and reliability; in some applications, it may cost you the entire design. Remtec builds are not “better PCBs,” but fundamentally different platforms. Here are eight “truths” to demonstrate that difference.

Rethinking Reinforcement Materials for Advanced Packaging

05/14/2026 | Ivana Ivanovic, Flexiramics B.V.
Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.

Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components

05/13/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Underfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces. 

Powering the Future: Why Thermal Management Defines the Future of Electronics

04/15/2026 | Brian Buyea -- Column: Powering the Future
Every leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.

Kurtz Ersa Brings Selective Soldering and Large-Board Rework Power to EPTECH Toronto and Montreal

04/02/2026 | Kurtz Ersa Inc.
Kurtz Ersa Inc., a leading supplier of electronics production equipment, in collaboration with its long-time Canadian representative Comtree Inc., is headed to EPTECH Toronto 2026 on April 21 and EPTECH Montreal 2026 on April 23.
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