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Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics

10/28/2025 | John Watson -- Column: Elementary, Mr. Watson
If electricity were a group of college students, then power electronics and the PCB designers who dive into it would insist on driving the car on every road trip because they know the car inside and out—they’re the students with jumper cables in the trunk, a tire pressure gauge in the glove box, and snacks stashed under the seat. While the others argue over playlists and directions, power electronics is busy ensuring the alternator doesn’t fry, the headlights don’t dim, and everyone reaches the destination with fuel still in the tank.

Peters Spotlights Heatsink Paste at productronica

10/22/2025 | Peters
The ELPEPCB HSP 801 S heatsink paste is considered a premium product for Peters when exhibiting at the upcoming productronica. At the world’s leading trade fair for electronics development and manufacturing which will take place in Munich from November 18 to 21, 2025.

Aismalibar North America Showcases Advanced Thermal Management Solutions at The Battery Show North America 2025

09/18/2025 | Aismalibar
Aismalibar North America, a leader in high-performance thermal management solutions, will present its latest innovations at The Battery Show North America and Electric & Hybrid Vehicle Technology Expo 2025 in Detroit, Michigan, October 6–9, 2025, where attendees can meet the team at Booth #5929 to explore materials engineered for demanding EV and high-power electronics.

September 2025 PCB007 Magazine: The Future of Advanced Materials

09/16/2025 | I-Connect007 Editorial Team
Moore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.

Akrometrix Announces Next Generation Thermal Warpage Measurement Tool the PS600T

09/05/2025 | Akrometrix LLC
Akrometrix, LLC, the leading provider of Thermal Warpage and Strain Metrology Equipment for semiconductor and electronics industries, recently announced the next generation in thermal warpage metrology with its PS600T system.
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