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New IPC White Paper Focuses on Use of Artificial Intelligence in Automated Optical Inspection in Electronics Manufacturing
February 6, 2025 | IPCEstimated reading time: 1 minute
A new white paper, “Unlocking AI for Automated Optical Inspection” released today by IPC’s Chief Technologist Council, focuses on AI’s role in AOI processes for printed circuit board assemblies (PCBAs). According to data within the white paper, recent advancements in technology, particularly in Cloud AI, IoT and Smart Manufacturing, have provided opportunities to further enhance AOI performance. AI solutions leveraging deep learning and edge computing technologies have shown significant improvements in AOI accuracy and efficiency.
While the white paper focuses on the application of computer vision AI for automating inspection (i.e., applying AI for pattern recognition on inspection images), the rapidly growing availability and maturity of generative AI presents future possibility in generating inspection criteria.
Key focus areas within the white paper include:
- AI systems explanation
- The use of AI in AOI
- Challenges with deploying AI on the manufacturing floor
- “AI Enhancement to AOI for PCBA” project
- Technical Strategy Recommendations
“AI has shown significant potential in the realm of AOI, particularly in improving detection accuracy, reducing manual intervention and improving production efficiency. It presents many opportunities for the electronics manufacturing industry to increase reliability, speed up time to market and reduce costs and time associated with manual adjustments to systems,” said Matt Kelly, IPC chief technology officer and vice president of technology solutions. “However, several challenges must be addressed before AI can be widely adopted on electronics manufacturing production floors. AI research, industry collaboration and an ecosystem of standards, will help close the gap in AI adoption within the electronics manufacturing industry.”
Download “Unlocking AI for Automated Optical Inspection" here.
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U.S. CHIPS Act Funding Detailed on SIA Website
09/12/2025 | Nolan Johnson, I-Connect007The U.S. CHIPS Act has moved well into the implementation stage in 2025. But where has that money gone? The Semiconductor Industry Association has been tracking these projects and provides details on its website. It was updated May. Among the five key programs being managed under CHIPS, two stand out as influencing advanced electronic packaging: the National Advanced Packaging Manufacturing Program (NAPMP), and the CHIPS Manufacturing USA Institute (MFG USA).
Zhen Ding Drives AI-Powered Digital Transformation
09/12/2025 | Zhen DingDriven by the surging demand for computing power fueled by AI, the semiconductor and PCB industries are forging closer integration, expanding their ecosystems, and pursuing shared growth. PCB has already become another NT$ trillion-dollar industry in Taiwan, growing in tandem with the semiconductor sector.
Flex Named to TIME's World's Best Companies List for Third Consecutive Year
09/12/2025 | FlexFlex announced its inclusion on the TIME World's Best Companies 2025 list. This marks the third consecutive year the company was included in this prestigious ranking, which recognizes top-performing companies across the globe.
Secure Semiconductor Manufacturing Acquires Full SMT Line from Manncorp
09/11/2025 | ManncorpSecure Semiconductor Manufacturing, LLC (SSM), an American-owned company dedicated to producing secure printed wiring boards and advanced assembly solutions in the MidWest USA, today announced the acquisition of a complete surface mount technology (SMT) line from Manncorp.
GlobalLogic, Ericsson Deploy Private 5G Network at Hitachi Rail’s State-of-the-Art Digital Factory
09/11/2025 | BUSINESS WIREGlobalLogic Inc., a Hitachi Group company and leader in digital engineering, has designed and deployed a state-of-the-art 5G private network at Hitachi Rail’s most digitally advanced facility in Hagerstown, Maryland, USA.