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Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
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Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
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If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
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LPMS USA to Offer Live Molding Demos at IPC APEX 2025
February 7, 2025 | LPMS USAEstimated reading time: Less than a minute
LPMS USA, a leader in low pressure molding solutions, is thrilled to exhibit at IPC APEX 2025. Join us at Booth #2300 for live molding demonstrations using the innovative KAPPA 1100H.
Low-pressure molding is an innovative, fast, and efficient process that encapsulates, seals, and protects electronics in a single step. Whether you need to waterproof delicate electronics, overmold cable harnesses, or safeguard LEDs, this process speeds up production, lowers environmental impact, and cuts costs compared to traditional potting methods, all while providing reliable protection for your components.
At the event, we’ll showcase the KAPPA 1100H, a compact, operator-friendly machine that prioritizes safety and ease of use. This machine highlights our commitment to delivering high-quality, reliable solutions tailored to meet the demands of modern electronics manufacturing.
Join us at Booth #2300 to explore how LPMS USA can help you streamline production and protect your products.
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SAICEC, Siemens to Accelerate Chip-to-Vehicle Validation Using Digital Twin Technology
11/17/2025 | SiemensSiemens announced that SAICEC, a leading provider of chip and system design services for the automotive industry, has begun building complex digital twins of automotive architectures based on Siemens’ PAVE360™ software, facilitating comprehensive verification of automotive components from system-level to chip-level.
November 2025 PCB007 Magazine: Getting to Know Our Columnists
11/17/2025 | I-Connect007 Editorial TeamThis month, PCB007 Magazine expresses gratitude to the industry columnists who share their expertise, insights, and perspectives each month. From technical innovations and process improvements to marketing and management strategies, these contributors form the backbone of our mission to educate and connect the PCB industry.
ioTech Introduces io600
11/14/2025 | ioTechAhead of productronica 2025, ioTech unveils the io600, a next-gen platform that brings intelligence, scalability, and agility to digital material deposition.
Discover the Benefits of Inkjet with Electra Polymer at Productronica 2025
11/10/2025 | Electra Polymers LtdElectra Polymers will be showcasing ElectraJet® EMJ110, our advanced low-loss inkjet soldermask, ideal for high-speed and high-frequency PCB applications, at productronica 2025.
Nortech Systems Incorporated Earns AS9100 Certification for Monterrey, Mexico Facility
11/04/2025 | BUSINESS WIRENortech Systems, Incorporated, a leading provider of design and manufacturing solutions for complex electromedical devices and electromechanical systems, announced that its Monterrey, Mexico, facility has achieved AS9100:D certification.