Target Condition: Are Autorouters Friend or Foe?
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
Elementary Mr. Watson: Retro Routers vs. Modern Boards—The Silent Struggle on Your Screen
Dan Beeker on the Design Engineer of the Future
February 7, 2025 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute
As technical director at NXP Semiconductors, Dan Beeker specializes in EMC and signal integrity design techniques. He’s known for his field-based design classes; you may remember the cover of Meghan Trainor’s “All About That Bass” that Dan and his daughter Breezy released in 2015 titled “All About The Space.” Check it out on YouTube; it’s funny, and it definitely gets the point across.
As we begin 2025, I contacted Dan to get his thoughts about the design engineers of the future. What will their jobs look like?
Andy Shaughnessy: Dan, how will the typical PCB design engineer’s job evolve over the next five to 10 years?
Dan Beeker: The challenges will be driven by the changes in technology. Smaller IC geometries for transistors and packages and increased power supply requirements make the basic functional design more challenging. Evolving standards for reduced allowable radiated emission levels and increased levels of immunity will impact compliance.
A solid understanding of the underlying science of electromagnetic physics will be more critical than ever. Improvements in the design tool space may help, but until the tools are dielectric-aware and can manage the entire three-dimensional structure of the electronic control system, they will only provide false hope. Careful empirical evaluation of each design will still be the primary method for designing good PCBs.
To read this entire conversation, which appeared in the January 2025 issue of Design007 Magazine, click here.
Share on:
Suggested Items
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
SMT007 Magazine July—What’s Your Competitive Sweet Spot?
07/01/2025 | I-Connect007 Editorial TeamAre you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche—what are their insights? In the July 2025 issue of SMT007 Magazine, we spotlight companies thriving by redefining or reinforcing their niche and offer insights to help you evaluate your own.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.
NVIDIA RTX PRO 6000 Shipments Expected to Rise Amid Market Uncertainties
06/24/2025 | TrendForceThe NVIDIA RTX PRO 6000 has recently generated significant buzz in the market, with expectations running high for strong shipment performance driven by solid demand.
Green Circuits Boosts Test Capacity with New Takaya APT-1600FD System
06/24/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce the purchase of its fourth Takaya APT-1600FD Double-sided Flying Probe Test System.