-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
A Look Back at 2025
Innovation rippled across the entire electronics supply chain in 2025, from semiconductor packaging and substrate materials to denser boards and more robust designs. This issue explores these defining moments and what we can expect in the year to come.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
AI Server Growth in 2025 Faces Uncertainties, DeepSeek Effect to Boost AI Inference Share
February 13, 2025 | TrendForceEstimated reading time: 1 minute
TrendForce’s latest investigations reveal that global AI server shipments grew by 46% in 2024, driven by strong demand from CSPs and OEMs. However, multiple factors, including US chip restrictions, the DeepSeek effect, and supply chain readiness for GB200/GB300 racks, could impact AI server shipments in 2025. TrendForce has outlined the following three scenarios based on these uncertainties.
The base case—considered the most probable—factors in Microsoft, Meta, Amazon, and Google’s recent announcements of increased capital expenditures in cloud and AI infrastructure, with expected annual growth exceeding 30%. This investment is expected to sustain momentum for AI server demand.
Currently, the supply chain outlook for shipments of AI servers remains stable. Under this scenario, global shipments of AI servers in 2025 are projected to grow by nearly 28% year-over-year. However, if GB200/GB300 rack shipments face scaling challenges, CSPs may prioritize HGX, MGX, or their own ASIC-based infrastructure instead.
The worst case scenario, with the second-highest probability, estimates the growth of AI server shipments to slow to 20-25% based on three key factors: First, stricter US regulations on AI chip exports to China create greater market uncertainty. Second, delayed shipments of NVIDIA GB racks as their complex design pushes large-scale deployment to the second half of 2025. The GB300, set for release around the same time, features higher specifications, which could extend testing and validation timelines for server rack systems. Lastly, the DeepSeek effect, which may lead customers to reduce dependence on high-end AI solutions.
The most optimistic scenario (bullish case) assumes proactive AI policies from both the US and China, such as the US’ Stargate Initiative, which could accelerate AI server deployment.
While DeepSeek may impact high-end GPU adoption, US-based CSPs are procuring proprietary ASIC AI servers faster than expected. Additionally, DeepSeek is expected to expand AI applications, driving edge AI server growth. Based on these factors, AI server shipments could increase by nearly 35% in 2025.
TrendForce highlights that DeepSeek’s influence will drive CSPs toward lower-cost proprietary ASIC solutions, shifting focus from AI training to AI inference. This shift is expected to gradually increase the share of AI inference servers to nearly 50%.
While GPUs will remain essential for developing AI models, the market will become more segmented. CSPs focusing on large-scale AI algorithms will continue investing in high-performance solutions, while cost-sensitive enterprises at the edge will prioritize more economical alternatives.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
YINCAE's TM230D Introduced: Innovative 3-in-1 Solderable Adhesive
03/06/2026 | YINCAEA breakthrough in advanced packaging materials has arrived with the introduction of TM230D, an innovative 3-in-1 sintering material designed to simplify processing while delivering exceptional thermal & reliability performance for next-generation power electronics & high-performance semiconductor applications.
SolderKing Expands Solder Paste Range with SAC0307 Low-Silver Alloy Option
03/05/2026 | SolderKingSolderKing Assembly Materials has launched SAC0307, a new low-silver addition to its SK P2-5 solder paste range.
KOKI Showcases BIG Low-Ag and ICT-ready Solutions at APEX EXPO 2026
03/05/2026 | KOKIKOKI Solder America, a global leader in advanced soldering materialsannounces that it will be exhibiting at APEX EXPO 2026, taking place March 17–19 at the Anaheim Convention Center in Anaheim, California.
Podcast Episode 2— AI Is Changing the Rules: Are Your PCB Materials Ready?
03/06/2026 | I-Connect007I-Connect007 announces the release of the second episode in its new six-part podcast series, PCB Materials: The Backbone and Future of Electronics. In “5G, AI & Beyond—Designing for High-Speed Performance,” we explore how artificial intelligence is reshaping the rules of electronics design, demanding unprecedented speed, power, and high-frequency performance that push beyond the limits of traditional materials. As AI applications scale rapidly, are yesterday’s materials becoming obsolete?
India and Southeast Asia: Strengthening Global Electronics Manufacturing Through Skills, Standards, and Collaboration
03/05/2026 | Arpita Das, Global Electronics AssociationAs the global electronics industry convenes at APEX EXPO 2026, the India and Southeast Asia region stands out as one of the most active and strategically important contributors to the global electronics ecosystem. Rapid manufacturing expansion, sustained workforce development, and growing alignment with global standards are reshaping how the region engages with international supply chains. For the Global Electronics Association, APEX EXPO provides an important platform to reflect on recent progress across India and Southeast Asia and to advance collaboration with global industry stakeholders.