DuPont to Discuss Development of EUV Photoresists at SPIE Advanced Lithography + Patterning Conference

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DuPont today announced its participation in the 2025 SPIE Advanced Lithography + Patterning conference, taking place Feb. 24–28 in San Jose, California. DuPont will showcase its latest innovations through technical presentations focused on the development of photoresists for extreme ultraviolet (EUV) lithography and advancing sustainability in the design of lithographic materials.

Advanced Solutions for EUV Lithography

DuPont technical experts will present multiple sessions on advancements in materials for EUV lithography on topics such as improving resolution, line edge roughness, and sensitivity through advanced material design. These sessions reflect learnings from the development of the new DuPont™ EON™ EUV photoresist platform. DuPont will also share from its work in materials development for next-generation EUV lithography, using novel photoresist compositions to achieve increased tunability and performance for increasingly complex technology needs.

“EUV lithography is driving the future of semiconductor manufacturing, making incredibly powerful chips possible for high performance computing in applications like 5G connectivity, AI tools, and autonomous vehicles,” said Randal King, Vice President of R&D/Technology, DuPont Electronics & Industrial. “DuPont is committed to advancing innovation in lithography materials to meet the needs of our customers’ exciting and fast-moving technology roadmaps.”

Sustainability-Driven Innovation in Lithographic Materials

Another key highlight of DuPont’s participation will be presentations on developing more sustainable lithography solutions, including the launch of a new offering for KrF lithography, DuPont™ UV™ 26GNF photoresist. DuPont™ UV™ 26GNF is the company’s first commercial photoresist offering which substitutes traditional fluorine-containing photoacid generators (PAGs) with a non-fluorinated alternative. DuPont™ UV™ 26GNF photoresist can help fabricators advance sustainability goals, addressing environmental and regulatory challenges associated with per- and polyfluoroalkyl (PFAS) – substances of concern.

“Our newest addition to the DuPont™ UV™ photoresist family – UV™ 26GNF – represents a significant advancement in delivering sustainability-first innovations for the semiconductor industry,” said Drew Chambers, Global Business Director, Lithography Technologies, DuPont Electronics & Industrial. “We’re finding fabricators increasingly want to incorporate more sustainable lithography materials in their processes, while continuing to meet stringent performance targets, and we’re proud to offer DuPont™ UV™ 26GNF photoresist in support of those goals.”

DuPont experts will also highlight progress in designing and synthesizing non-PFAS PAG solutions, which represent an important step toward developing more sustainable photoresist materials across multiple lithographic technologies.

DuPont’s presentations are part of the Advances in Patterning Materials and Processes Conference. To learn more about DuPont’s offerings for lithography, including the new DuPont™ EON™ photoresists for EUV lithography and DuPont™ UV™ 26GNF KrF photoresist, set up a meeting with a DuPont representative at the conference or visit the DuPont Electronics & Industrial website.