-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Nordson Electronics Solutions Introduces ASYMTEK Select Coat SL-1040 Ultrasonic Cleaning Station for Maintaining Conformal Coating Equipment
February 13, 2025 | Nordson Electronics SolutionsEstimated reading time: 1 minute

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, announces their latest technology innovation for conformal coating systems, the ASYMTEK Select Coat® SL-1040 Ultrasonic Cleaning Station (patent pending) to keep nozzles and needles clean, and prevent clogging during production. The cleaning process is programmable and is integrated with a self-leveling solvent system. This preventive maintenance helps to stop issues before they occur to sustain smooth conformal coating operations and provide better yields. Integrated with the ASYMTEK Select Coat® SL-1040 conformal coating system, the ultrasonic cleaning station will be demonstrated at the Nordson booth #3200 at the IPC APEX EXPO, 18 – 20 March, in Anaheim, California, USA.
The ultrasonic cleaning station uses a non-invasive process to remove material build-up adhering to nozzles and needle tips during conformal coating operations. Cavitation bubbles are induced by high-frequency pressure waves to agitate solvent and, without brushing, reach where other cleaning methods cannot touch. This process leads to better production efficiency with less clogging and downtime and more application consistency. Benefits also include reduced costs related to maintenance and repair.
Programmable through ASYMTEK EasyCoat® 6 software, the ultrasonic cleaning station can be set up to run before the coater starts, at the beginning of a coating program, or periodically as the user defines. In addition, the cleaner is integrated with the coater’s self-leveling solvent system to automatically maintain the correct solvent level. When the solvent level is low, the system sends a refill notification and continues to run until an operator completes the refill, based upon the user-defined grace period.
To learn more about this innovation, as well as the revolutionary SELECT Synchro selective soldering system, visit the Nordson booth #3200 at the IPC APEX EXPO, 18 – 20 March, in Anaheim, California, USA. Or, see the ultrasonic cleaner featured in the vide on the ASYMTEK Select Coat SL-1040 Conformal Coating System page at nordson.com.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.