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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

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Suggested Items

Summit Interconnect Celebrates 10 Years

07/28/2026 | Marcy LaRont, I-Connect007 Magazine
Ten years ago, Shane Whiteside had a vision for the dwindling North American PCB industry: to develop a company at scale that would put North American PCB manufacturing back on the map. The result was the combination of six PCB organizations and complementary businesses to create Summit Interconnect, now the second-largest PCB manufacturer in North America. In this interview, Summit CEO Shane Whiteside and Vice President of Technology Gerry Partida reflect on Summit's 10th anniversary, the pride they take in what they've built, and the enthusiasm they still bring to the business as they celebrate this milestone.

SMT Perspectives & Prospects: The Architecture of Winston Churchill’s Leadership

07/24/2026 | Dr. Jennie Hwang -- Column: SMT Perspectives and Prospects
I was recently invited to visit the U.S. Embassy and the Churchill War Rooms in London, where I met Warren Stephens, U.S. ambassador to the UK, and Bank of England Gov. Andrew Bailey. From those modern diplomatic corridors to the stark resolve of a wartime bunker, the experience reminded me that leadership in this ever-shifting global landscape is, at its best, about bridging the wisdom of the past with the realities of the present.

The Right Approach: The Pros and Cons of PCB Vertical Integration

07/21/2026 | Steve Williams -- Column: The Right Approach
Vertical integration in PCB fabrication is a genuinely contested strategic question with real tradeoffs on both sides. The core tension: Fabricators integrate up into design and down into assembly to gain margin and stickiness, but risk diluting their manufacturing focus and alienating the EMS and design-house partners they depend on.

Learning with Leo: The Cost of Cleaning and Protecting the Ozone Layer

06/03/2026 | Leo Lambert -- Column: Learning With Leo
I share this perspective based on my experience as a member of the United Nations Environment Programme (UNEP) Solvent, Coatings and Adhesives Technical Options Committee, which developed the report “Protecting the Ozone Layer” to inform policy decisions at the 1995 Meeting of the Parties to the Montreal Protocol in Nairobi. My involvement in this work dates back to 1976, when I joined Digital Equipment as an engineer supporting manufacturing operations, focusing on soldering and cleaning processes across global facilities.

The AI Tipping Point: Transforming Global Material Supply Chains

06/01/2026 | Marcy LaRont, I-Connect007 Magazine
While the AI revolution has the world focused on the promise of solving our most complex challenges, some laminate and PCB fabricators are raising concerns that the high-performance materials used to build AI data centers will gobble up the precious resources needed to produce them. PCB industry expert Mark Goodwin, COO of Ventec International, a laminate and equipment supplier, has expressed his concerns about the critical shortage of glass and copper, which he believes will worsen.
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