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Are Domestic Assemblers Ready for the Next Level of Electronics Miniaturization?
February 19, 2025 | Chrys Shea, SHEA Engineering ServicesEstimated reading time: 1 minute

UHDI technology is more than another evolutionary level of miniaturization. It’s a fundamental change in how we create circuit boards, on a scale potentially as impactful as the transition from through-hole to surface mount was 40 years ago.
Traditional and high density interconnect (HDI) PCB manufacturing technology that uses subtractive copper etching processes cannot repeatably produce features below 75 microns and vias below 150 microns. UHDI fabrication blows those limits away with additive or semi-additive processes that can produce lines and spaces as small as 12 microns and vias of 75-100 microns, increasing circuit density by a whopping 10–30X.
UHDI is not new or uncommon technology. It’s in the palm of our hands as it’s been in mobile products since the iPhone 6 launched in 2014. While it has proven its capabilities in consumer electronics, it needs significant development and evaluation to be considered robust enough for aerospace and defense electronics, where the benefits of miniaturization are extensive, but the implication of malfunction is far greater than in similar consumer-grade devices.
As with most modern PCB fabrication technologies, Asia leads America in the development and scaleup of UHDI. To realize the multitude of benefits from PCB densification in security and defense electronics, the U.S. government has begun funding R&D for domestic PCB fabrication, and several shops are gearing up to produce UHDI technology for high-performance, high-reliability applications. While the fabrication industry is abuzz with news of innovative materials, processes, and technologies, the assembly side has remained relatively quiet.
To read the entire article, which published in the February 2025 issue of SMT007 Magazine, click here.
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08/05/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. This article explores the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
UHDI Fundamentals: UHDI Drives Unique IoT Innovation—Smart Homes
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Real Time with... IPC APEX EXPO 2025: Emerging Trends in Design and Technology
04/16/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy speaks with IPC design instructor Kris Moyer to discuss emerging design trends. They cover UHDI technology, 3D printing, and optical data transmission, emphasizing the importance of a skilled workforce. The role of AI in design is highlighted, along with the need for understanding physics and mechanics as designs become more complex. The conversation concludes with a focus on enhancing math skills for better signal integrity.
Real Time with... IPC APEX EXPO 2025: Insights into PCB Design and Manufacturing with Polar Instruments
04/03/2025 | Real Time with...IPC APEX EXPOErik Bateham discusses Polar's latest book, which enhances insights for PCB designers and manufacturers. The book, "The Designer's Guide to... More Secrets of High-Speed PCBs," features a guest chapter on 2D via design modeling. Erik highlights the industry's shift towards UHDI and the challenges in measuring at micron levels.