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Rehm Thermal Systems Brings Pioneering Manufacturing Technologies to productronica China 2025

02/11/2025 | Rehm Thermal Systems
Rehm Thermal Systems will be presenting its further developments in areas such as convection soldering under vacuum, condensation soldering, coating and dispensing in Hall E4 of the Shanghai New International Expo Centre from 26 to 28 March.

SIA Applauds CHIPS Act Incentives for Infinera, Corning, Edwards Vacuum, and GlobalFoundries

01/20/2025 | SIA
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending a series of CHIPS and Science Act agreements announced by the U.S. Department of Commerce.

Altus Highlights Heller Industries Advances in Void Reduction Under 1%

01/06/2025 | Altus Group
Altus Group, a leading distributor of capital equipment in the UK and Ireland, emphasises the importance of reducing voids in reflow soldering to improve manufacturing efficiency and product reliability

Overview of Soldering Systems With Vacuum

12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbH
When soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.

SMT007 Magazine Explores Soldering Technologies—December 2024

12/02/2024 | I-Connect007 Editorial Team
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
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